▋Product Specifications
| Model No | LGA2011/2066-1U-HS | CPU TDP | 95W |
| CPU Socket type | Intel LGA2011 square and LGA2066 sockets | Fin Thickness | 0.35mm |
| Server Form Factor | 1U Server | Fin pitch | 1.9 mm |
| CPU Cooler dimensions | 88*88*25mm | Heatsink material | Copper fin + Copper base+ fan |
| Weight | 450 g | CPU pitch-row | 80*80mm |
| Voltage | 12V | Cooling Type | Active |
▋Product Description
Lori's high performance passive copper heat sink is designed for CPUs, AI and other high-powered processors that fit the Intel LGA2011 square and LGA2066 sockets. These straight copper skived fin heat sinks feature optimized fin designs to meet a wide range of requirements as well as an optional standard back plate to accommodate the cooling of any high powered device. If you are looking for high performance copper passive heat sink for CPUs and other AI high-powered processors, please contact us.
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CONTACT INFO
E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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