Professional High Power Cooling Solution Service Provider And Heat Sink Manufacturer

Heat Pipe

Heat pipes are very efficient at transferring heat from a heat source to a cooling area which are usually connected to a custom heat sink

Lori demonstrates the effectiveness of heat pipe solutions with our unique custom designs. The design concept is to insert a metal block between the two layers to conduct heat from the transceiver to the custom heat sink placed in the back of the rack through a heat pipe connecting the block to the custom heat sink. The results show that the customized heat pipe with heat sink for 5G heat dissipation, performance can be improved by more than 20 percent at very low air flow rates, which is a significant improvement from the standard solution. Lori is able to maximize heat pipe cooling performance by utilizing the available space in the system, thus providing effective thermal solutions for valuable customers.

5G heat sink types

Lori is a professional manufacturer of 5g heat sink, which can design and customize various types of 5g heat sink for you. It's mainly 5G base station heat sink, server heat sink, chip heat sink and processor heat sink on 5G equipment.

5G base station heat sink

Reliability design is an important design link in communication system design, and the heat dissipation effect of equipment, especially the heat dissipation design of high power equipment, has a crucial influence on the reliability of equipment.

Michael o 'hara, chief marketing officer of the GSMA, a mobile trade group, said: "when data is moving at these very high speeds, the distances have to be reduced, so people have to have more antennas and data centres at the point of content acquisition.Basically every data lamppost has to have an antenna."In other words, the data channel must get shorter as it gets wider.

Base station is a radio transceiver that transmits information between the terminal and the mobile communication exchange center in a certain radio coverage area. It is important information hub of the wireless communication system. At present, base station is developing in the direction of large capacity, high power and high integration, and the heat dissipation per unit volume is also increasing, while the volume is getting smaller. The thermal design of base station has become an increasingly important problem in the design of base station complete machine. Normally, when the temperature exceeds a certain value, the failure rate of electronic devices increases exponentially with the increase of temperature.Improper cooling system is one of the main reasons for the decrease of the reliability of the electronic devices. 20% of the failures of electronic devices are caused by high temperature. Nowadays, the arrival of 5G requires more powerful severs to support the successful information transmission. 5G network signals have higher reliability and lower delay, which can meet the specific needs of intelligent manufacturing, automatic driving and other industries. For 5G network infrastructure construction  pattern to transform to the intensive, miniaturization, intelligent, traditional large base stations have been difficult to meet the demand of the construction of the 5G base station. Base station heat sink must keep cool in the operation process, multiple fever semiconductor components such as CPU, chips must be closely together to achieve the best electrical properties, but also to cooling under this compact configuration. The high capacity 5G base station market favors low cost and high heat dissipation requirements, requiring the use of heat sinks,cooling devices,heat pipes or thermal interface materials(TIM), rather than using liquids that require electricity or forced liquids. LORI is able to dissipate these high heat fluxes using heat pipes with high thermal conductivity, providing a safe operating environment.

5G base station heat sink

 5G Server heat sink

Nowadays, the upcoming 5G requires more powerful servers to support the successful information transmission. 5G network signals have higher reliability and lower delay, which can meet the specific needs of intelligent manufacturing, automatic driving and other industries. Therefore, we also need to cool the server, we have provided a liquid cool solutions for 5G servers. The working principle of this liquid-cooled cooling method is to directly cool the electronic equipment by using heat pipes equipped with liquid cooling . After the coolant absorbs heat, the liquid temperature rises and can be used for heating. Heat can also be distributed to the outdoor air, cooling liquid temperature, and then send the cooling liquid to the heat pipe of electronic equipment. Since the main benefit of the water cooling plate to the server is to take away the heat nearby, it can have a high energy saving effect, at the same time, greatly improve the high power density to reduce the size of the server, reduce the fan noise, and easily realize the heat recovery and other benefits. The main technical feature of the water cooled heat sink is that the main board of the server is installed in pairs on the two outer sides of the heat sink, which flows through the cooling water with lower temperature to take away heat. High heating elements, such as CPU and north-south bridge chipset, are installed close to the cooling water in the heat sink, so that the heat generated is carried away by the cooling water in the heat sink; In some cases, server fans or power fans are installed on a server motherboard on one side to take heat away from the memory and hard disk.

With rich experience in water cooling heat sink, Lori has provided water cooling solutions and manufacturing for communication companies all over the world. Lori heat sink factory is equipped with advanced CNC equipment, friction welding equipment, welding equipment, testing equipment, can provide customers with a large number of water cold plate.

5G processor heat sink 

LORI adopts liquid cooling technology to deal with the 5G heat dissipation of CPU system.The water cooling system is composed of water ice, circulating coolant, water pump, corresponding pipes and heat exchangers. Water cooling plate are usually copper or aluminum plate, which have excellent heat transfer performance. Vacuum pipes are reserved inside these metal blocks to store coolant and circulate it. The water cooling plate and the CPU can directly contact and absorb the heat generated by the CPU. Through the forced action of the pump, the circulating coolant flows repeatedly in the flow pipeline of the water cooling block, so as to take away the absorbed CPU heat and turn the high temperature into the low temperature, so as to achieve the purpose of cooling the CPU of the 5G equipment. Heat can be transferred out through the heat exchanger into the heat sink, heat sink surface area, heat dissipation effect is good, the fan in the form of strong convection heat into the air.The advantages of this water-cooled heat dissipation mode are good heat dissipation effect and low noise, which are widely used in some large service stations.

5G chip heat sink

In order to meet the requirements of the reliability of thermal equipment of electronic equipment, control the chip temperature within a certain range and reduce the failure rate of equipment, the thermal design of high power chips must be carried out. Lori has rich experience in chip cooling.

There are many gullies or gaps between the bottom surface of the heat sinkand the chip surface, all of which are air. Because air is the bad conductor of heat, so air gap can affect come loose badly efficiency, make the performance of heat sink is greatly at a discount, cannot produce action even. In order to reduce the gap between the chip and the heat sink, increase the contact area, must use heat conduction material with good heat conduction performance to fill, such as heat conducting tape, heat conducting pad, heat conducting silicon ester, heat conducting adhesive, phase change material. Chip heat by conductive material is passed to the heat sink, and for the most part by high speed rotating fan will heat by convection (forced convection and natural convection) way to go to the surrounding air, force the heat removal, forming from the chip, and then through the heat sinkand thermal conductive materials, heat dissipation pathways into the surrounding air.

LORI has extensive experience working with major global brands for solving thermal issues. With simulation software such as SolidWorks and test equipment, Lori is committed to putting our cooling solutions through a series of reliability checks to ensure that the product is up to standard. With a proven track record in product development and an experienced engineering team, Lori is committed to designing and implementing custom thermal solutions at the best possible price for customers compared to competitors. 

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