With 5G footsteps getting closer, the data traffic demand continues to soar, network load increased significantly, the number of communication base station is also more and more, because of communication station to have certain requirements in sealing, and transmitting equipment in operation process is easy to generate a lot of heat, the base station power consumption and equipment heat dissipation problems become increasingly serious, so need to heat dissipation, communication base station existing technology mainly adopts air conditioning refrigeration for cooling. Although it can achieve the cooling operation, but the area is larger also, large energy consumption and easy into the dust and, not conducive to the maintenance of equipment, so the applicability and practicability is restricted. Lori provides 5G heat sink cooling design and manufacturing solutions to support higher power load in a fully integrated system, prolong the life of the sensitivity and 5G equipment, Lori’s advanced cooling technology is able to meet challenging environmental requirements, including zipper fin,  heat pipe, liquid cold plate, vapor champers, custom skived fin , base station shell, etc.

Nowadays, the upcoming 5G requires more powerful servers to support the successful information transmission. 5G network signals have higher reliability and lower delay, which can meet the specific needs of intelligent manufacturing, automatic driving and other industries. Therefore, we also need to cool the server, we have provided a liquid cool solutions for 5G servers. The working principle of this liquid-cooled cooling method is to directly cool the electronic equipment by using heat pipes equipped with liquid cooling . After the coolant absorbs heat, the liquid temperature rises and can be used for heating. Heat can also be distributed to the outdoor air, cooling liquid temperature, and then send the cooling liquid to the heat pipe of electronic equipment. Since the main benefit of the water cooling plate to the server is to take away the heat nearby, it can have a high energy saving effect, at the same time, greatly improve the high power density to reduce the size of the server, reduce the fan noise, and easily realize the heat recovery and other benefits. The main technical feature of the water cooled heat sink is that the main board of the server is installed in pairs on the two outer sides of the heat sink, which flows through the cooling water with lower temperature to take away heat. High heating elements, such as CPU and north-south bridge chipset, are installed close to the cooling water in the heat sink, so that the heat generated is carried away by the cooling water in the heat sink; In some cases, server fans or power fans are installed on a server motherboard on one side to take heat away from the memory and hard disk.

With rich experience in water cooling heat sink, Lori has provided water cooling solutions and manufacturing for communication companies all over the world. Lori heat sink factory is equipped with advanced CNC equipment, friction welding equipment, welding equipment, testing equipment, can provide customers with a large number of water cold plate.

In order to meet the requirements of the reliability of thermal equipment of electronic equipment, control the chip temperature within a certain range and reduce the failure rate of equipment, the thermal design of high power chips must be carried out. Lori has rich experience in chip cooling.

There are many gullies or gaps between the bottom surface of the heat sinkand the chip surface, all of which are air. Because air is the bad conductor of heat, so air gap can affect come loose badly efficiency, make the performance of heat sink is greatly at a discount, cannot produce action even. In order to reduce the gap between the chip and the heat sink, increase the contact area, must use heat conduction material with good heat conduction performance to fill, such as heat conducting tape, heat conducting pad, heat conducting silicon ester, heat conducting adhesive, phase change material. Chip heat by conductive material is passed to the heat sink, and for the most part by high speed rotating fan will heat by convection (forced convection and natural convection) way to go to the surrounding air, force the heat removal, forming from the chip, and then through the heat sinkand thermal conductive materials, heat dissipation pathways into the surrounding air.