In the context of increasingly fierce market competition, as a relatively mature wireless base station product, its reliability requirements are increasingly high, especially for heat dissipation and noise put forward more stringent requirements, so Lori thermal solution team for wireless base station heat dissipation and noise improvement.
First of all, through the basic component unit of the wireless base station cooling path analysis, put forward a series of improvement measures, including the power amplifier unit heat heat sink optimization to improve the test method improvement, baseband board, thermoelectric refrigeration technology is applied to the battery cabinet cooling improvement, power supply, heat dissipation, noise improvement. Is to use the active or passive cooling heat dissipation, is the use of heat pipe heat sink or liquid cooling plate, in order to in a short time, analysis the feasibility and effect of improvement measures, the use of thermal simulation tools as the main means, respectively of the baseband board, battery cabinet, power board, modeling and simulation analysis to optimize the results of simulation analysis at the same time,The reliability accelerated life test method is used to verify the feasibility of the simulation results.
Secondly, based on the relation and distinction between heat and noise theory analysis, and then to improve the noise of wireless base stations, find the balance point of wireless base stations heat and noise, Lori with customers, through the method of speed control strategy on the premise of a small amount of increase or decrease costs, boost the reliability of wireless base stations.
Change going mobile network technology in the world, GSM, WCDMA and LTE with amazing transmission rate to meet the demand of the user's data, in which high frequency materials and heatsink has played a key role. As the rebound, antenna, power amplifier, microwave, small base station is an important part of a create mobile communication network, such as low loss dielectric material is also the foundation of the technology. In the future, high frequency materials and thermal technology also will be the next generation mobile network, which will reach millimeter wave band 5G key technology.