Shallow buried pipe technology: it is suitable for single-side installation device. After flattening copper pipe and aluminum cold plate, it can mill the surface at the same time, which is fully conducive to the high thermal conductivity of copper pipe to take away heat, and the light weight of aluminum can reduce weight and cost control.
Deep buried pipe process: suitable for packing high thermal conductivity epoxy resin imported from the United States, double side device temperature difference requirements are not high, single and double side device installation, because the thickness of copper pipe without secondary processing, and packing protection can provide application safety, especially suitable for cold plate using refrigerant as medium.
Welding process: suitable for copper cold plate + copper heat pipe, so as to reduce the thickness of the plate to reduce weight.
Double-sided pipe clamping process: two-sided device installation, simple process and low cost; Aluminum cold plate + aluminum tube & copper tube & stainless steel tube.
Friction stir welding process: The process of friction stir welding is described as follows: it is a solid phase connection method under the action of mechanical force and friction heat. Friction stir welding process, a special convex shoulder and needle bar with the mixing head spinning slowly insert by welding, friction between the head and stir welding material shear resistance produced friction heat, the mixing head adjacent area of thermoplastic materials (welding temperature does not generally at and above the melting point of welding material), when the mixing head spin move forward, plasticizing of hot metal materials from the forefront of stir head backwards down the transfer, and the mixing head shoulder and workpiece surface friction heat and forging production, forming dense solid connection. liquid cold plate base material is AL6061.The cover plate adopts aluminum profile, and the fin of aluminum profile is used as the fin in the flow passage to form a whole after welding, and the heat dissipation results of both sides. Both heat dissipation efficiency and space saving are very effective. For IGBT,TEC and other areas with high power and high density, this is a good design choice. Through friction welding, a larger runner with the same thickness can be achieved than the buried copper pipe, and further reduce the thermal resistance. Especially in dealing with complex flow channels and some of the high and low flow channel is more flexible. As the overall material is basically the same after welding, more surface treatment methods can be selected, such as chromate, conductive oxidation, anode, nickel plating, etc.