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Bonded fins technique is a conventional high power heat sink manufacturing technique. Bonded fin heat sink may have the bad phenomenon of loose heat sink fins, especially with thick heat sink fins, which will loose or even fall off at a higher rate. LORI Thermal launched several bonding techniques via our own technical innovations and these include highly conductive thermal epoxy bonding, welding, thus, the reliability and stability of cooling are greatly improved and any potential risks are avoided. The features of bonded fin heat sinks include more fins per inch, smaller fin gap, and flexible profile height and width so that they are suitable for different sizes of application space. This kind of heat sink is small in size and light in weight, so it is an ideal choice for cooling high power equipment. Lori bonded fin heat sink wildly applied to IGBT Devices ,Welding Devices, Motor Devices, High Power Semi, Lasers System, Renewable Energy, Factory Automation.


In the high power applications where significant heat is generated in a small volume, Lori’s bonded fin heat sink designs can meet the packaging needs by increasing the heatsink surface area without increasing volume, reducing thermal resistance by 50% to 66%. Bonding fin heat sink removes the design limiting fin extrusion ratio found in extruded heat sink. Typical extrusion heat sink fin ratios range from 4:1 up to a maximum 16:1; while bonded fin heat sink designs allow ratios up to 44:1 or greater, providing cooling in forced convection for some high power applications. Bonded fins, fabricated from aluminum sheet through extrusion, are bonded to the  machined and grooved base with a highly conductive thermal resin.


Bonded fin heat sink features as the following:

1. Higher aspect ratio and high fin density of fins increase cooling surface area so the heat sink with high performance.

2. Lower thermal resistance for the high power device heat dissipation.

3. Aluminum fin, copper base, aluminum base can be assembled into bonded fin assemblies.

4. Fins fabricated from sheet metal or extrusion, custom designs available, the metal plate is made of fins, which can be cut to a specific size.

5. We can customize your wings according to thermal performance requirements and packaging size height restrictions. For more complex designs, we can extrude fins to specific shapes and lengths.

6. Used for high power forced convection cooling applications

7. Bonding resin with highly thermal conductive for minimal thermal loss







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Bonded Fin heat sink Information

Bonded Fin heat sink is the technology of choice when complete design flexibility with a cost effective, high performance solution is required. The Individual fins and grooved bases are joined together by epoxying, brazing or soldering. Brazing offers greater structural integrity and the high mechanical and thermal performance. Lori employs a variety of brazing techniques including CAB, vacuum, and dip brazing. Any bonded fin heat sinks assembly that contains copper components must be soldered or brazed. 

Fins and the base can be of either aluminum or copper material, and the fins can be of any functional height, width and length, which greatly improve thermal performance due to the increased surface area. Various materials or height can be combined in one bonded solution if necessary.

The bonded fin types can be manufactured in a number of methods. Bonded Fins are either stamped from coil stock or cut from thin plate stock. Grooved bases can be extruded, die cast, or cnc machined.

General Characteristics

Bonded fin Heat sinks are produced by using an aluminium base section into separate fins are assembled. The joint between the base section and the fin is made by using a special, high density epoxy resin to guarantee optimal heat flow from the base plate to the fins, or by razing or soldering. All heat sink types are available in any desired length and fin height.

Bonded fin heat sink general characteristics as the following:

1. Lower Tooling Costs in bonded fin heat sink manufacturing

  1. 2. No limit on length of airflow, available in any desired length and fin heigh
  2. 3. Higher aspect ratio and high fin density of fin improved Thermal Performance
  3. 4. Wide range of material and fabrication Option, Various materials can be combined 

Application

Bonded Fin Heat Sink for efficient air cooling of IGBTs and resitors. Lori offers high performance customized solutions for all IGBT and resistor types available on the market. Today's high power semiconductor must be efficiently cooled to take advantage of their high current capabilities. Conventionally air cooled extruded aluminum heat sinks have been an accepted cooling method used since the beginning of the semiconductor age. At present, with the continuous improvement of power density, the requirement of thermal performance for effective heat dissipation exceeds the limit of traditional extruded heat sinks.. To meet the increased performance demand Lori has designed a new generation of power heat sinks - high power bonded fin heat sink

These heat sinks are produced by using an extruded aluminium grooved base bonded into which Individual fins are assembled. The joint between the extruded grooved base and the fin is made by using a special, high density epoxy developed by lori together with a well-known producer of epoxy resin to guarantee optimal heat flow from the grooved base to the fins. The  the material is extremely high thermal conductivity in comparison to other epoxy-materials, and so enables the bonded fin heat sink to achieve a high thermal performance which exceeds all other assembly techniques.

In addition, Lori bonded fin heat sinks are also widely applied in many fields, like The Thermoelectric module, Uninterruptable power supply (UPS), Variable speed motor control, AC welding switch, Power rectifier, Laser power supply, Traction drives.

Custom Designs

Lori is always developing new bonded fin heat sink to meet our customer's requirements. If a custom solution is required, we will support your thermal modeling and assist you to design a new heat sink that meets your mechanical and thermal requirements. Lori offers a variety of bonded fin heat sink assemblies. Bonded fins can be made in a different way to meet your needs. You can choose from either natural or forced convection.

Lori Options for Custom Solutions

  • Material: Aluminum or Copper base and Aluminum and copper fins
  • Brazed, soldered ,High thermal conductivity epoxy to attach fins to base
  • Fin heights: .020 to 2.75 inches
  • Fin widths: up to 24.0 inches
  • Fin Densities:100+ fins per inch
  • Fin material thickness: .008 to .032 (fin height and densities depend on thickness)
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