|Place of Origin:||Shenzhen, China (Mainland)||OEM:||Yes|
|Material:||AL 6063 T5||Shape:||Square|
|Packing:||Standing Export Packing||Brand Name: ||LORI|
|Application:||IGBT Chip||Certificate:||ISO 9001:2008,ISO 14001:2004|
|Model Number:||IGHS003||Tolerance:||0.01 mm|
|Finish:||Degreasing, Anodizing||Quality control:||100% thermal test|
|Extra process:||Cutting + CNC Machining||Size:||200(W)*66(H)*200(L)mm, or custom design|
|Sample Service||Samples with differernt sizes are availabe for prototypes test within 1-2 week|
Bonded fin Advantage: Flexible pitch, height and width, manufactured without molds; smaller volume and lightweight, an ideal selection for cooling high power devices
◪ In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:
◪ 1.Provide online technical support for customers, and provide consulting services on related issues
◪ 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please contact with us in time. After checking and coordinating, we can return and replace the products in time.
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