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Professional High Power Cooling Solution Service Provider And Heat Sink Manufacturer

AI Thermal Management Solution

Whether it's training large models or implementing industrial intelligence applications, both rely on massive, high-performance computing support. With AI technology advancing rapidly today, internet giants like Google and ByteDance are continuously increasing capital investment in the AI sector. This drives the development of AI chips and infrastructure such as AI data centers, propelling the growth of AI computing power.

AI Evolution and Thermal Challenges

The core of artificial intelligence is to simulate human intelligence processes through algorithms. This technology has permeated various industries, ranging from natural language processing, computer vision to autonomous driving and medical diagnosis. The application areas of AI are expanding at an unprecedented speed. Each generation of AI computing power chips is increasing power consumption. For instance, NVIDIA has moved from the AI GPU chip A100 to the Hopper architecture's H100, H200, and the Blackwell architecture's B100, B200, etc. Each product represents a leap in computing power, while power consumption ranges from several hundred watts to several thousand watts, and the heat generated during workloads is also increasing.

Why AI Thermal Management Matters
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As AI cloud computing and data centers scale exponentially with large model parameters, thermal management has become a critical bottleneck constraining AI computing advancement. AI applications have propelled power density in servers and racks, generative AI, machine learning, and large-scale inference technologies to unprecedented levels. High-performance GPUs and AI accelerators require precise, scalable cooling systems to ensure operational speed, stability, and uptime.

Mainstream Cooling Technologies for AI

Currently, in the field of AI thermal management, there are several cooling technologies, each suitable for different scenarios and requirements.

As a traditional solution, air cooling technology is still applicable in low-density scenarios, but it has gradually failed to meet the heat dissipation requirements of high-power AI chips. When the power of a single cabinet exceeds 50kW, air cooling technology reaches its heat dissipation limit.
Liquid cooling technology has become the inevitable choice for high-density computing centers. It mainly includes two types: cold plate liquid cooling(direct to chip liquid cooling) and immersion liquid cooling. This technology can significantly reduce the PUE value of data centers, eliminating the heat dissipation obstacles for the stable operation of AI computing centers.
Phase change cooling technology utilizes the principle that liquids absorb a large amount of heat during boiling, and can remove high-density heat in an extremely short period of time. This technology is particularly suitable for dealing with the instantaneous peak power consumption of AI chips.
Lori's Customized AI Thermal Management Solution

In response to the diversity of AI application scenarios, Lori offers a full-stack customized thermal management solution, covering everything from the chip level to the data center level, to fully meet the cooling requirements. 

AI Autonomous Computing and Data Center Liquid Cooling System

Lori's AI server liquid cooling system adopts a modular design, which can be flexibly configured according to different AI workloads. Our solution supports power densities ranging from 30kW per single cabinet to over 100kW+, and is suitable for various scenarios from edge inference to large-scale training.

Edge AI Deployment Liquid Cooling Solution

For the specific environment of edge AI deployment, we have developed a compact liquid cooling system. Its volume is only 60% of that of traditional solutions, yet it provides the same heat dissipation capacity, meeting the efficient heat dissipation requirements in space-constrained environments.

Industrial and Medical Cooling Solutions

Industrial quality inspection AI systems, medical imaging analysis equipment (such as CT/MRI diagnostic assistance) and other devices need to operate stably for a long time. Lori will provide flexible and reliable cooling solutions based on the customer's requirements for cost, noise, and heat dissipation performance, etc.

Why Choose Lori AI Liquid Cooling Solutions

Among numerous thermal management solution providers, Lori stands as a trusted cooling partner in the AI field, distinguished by its specialized expertise, extensive experience, and innovative products.

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Our comprehensive technology portfolio is our core competitive advantage. Lori not only offers standard liquid cooling products but also possesses full in-house R&D capabilities spanning cold plates, manifolds, quick connectors, and CDU units. This ensures perfect component compatibility and delivers optimal thermal performance.

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Our extensive experience in AI deployment scenarios enables us to deliver practical solutions. We have provided thermal management solutions for numerous global AI computing projects, including large-scale training clusters, edge inference nodes, and hybrid computing environments, accumulating rich hands-on expertise.

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Lori's modular, scalable design allows customers to start with small-scale pilots and gradually expand to large-scale deployments, reducing initial investment risk. Our liquid cooling systems are also continuously upgraded to accommodate future increases in AI chip power consumption.

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Comprehensive service and support provide customers with full lifecycle services and technical assistance, from design consultation and installation commissioning to operational maintenance support.

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