Due to the rapid growth of power consumption of the chip, single chip power consumption increased to 300W ~ 500W, close to the limit of traditional cooling technology. And high power consumption chip into the mobile platform, equipment modularity, integration for the lightweight heat sink, miniaturization demand is also growing. Microchannel heat sinks have the advantages of high thermal conductivity, small size, small heat transfer group, etc., in high-performance electronic equipment, power electronic equipment, renewable energy systems and other applications have shown good thermal performance, is a highly efficient thermal management program. Microchannel heat sinks utilize the microfluidic principle to increase the ratio of surface area to volume, and are able to accelerate the heat transfer from the heat source to the coolant flowing through the microchannel.
Lori microchannel heat sink is mainly divided into microchannel liquid cooler and microchannel vapour chamber.
Microchannel Vapour Chamber
Lori micro-channel thermostats are lightweight, shaped, and nestable, and can be integrated with liquid and air cooling systems.In industrial-grade heat dissipation for servers, power and other applications.
Microchannel Liquid Cooler
Lori's microchannel liquid coolers can optimize channel geometry, flow arrangement and coolant selection to meet customer cooling requirements, providing excellent cooling performance in water-cooled systems. They are widely used in electric vehicles, wind power generation, solar power generation, train traction machines, charging piles, servers and other industrial cooling applications.
