1.Copper bonded fin heatsink
Copper bonded fin heatsink is composed of a heat sink base and fins, and fins are disposed on the heat sink base. The base and fins are made of copper. Machining several grooves on the base , and the width of the groove is slightly wider than the thickness of the fin, and inserted the processed fins into the grooves, and the fins are positioned by a special tool, and then inserted thin knife type tool between the two fins to apply pressure to base, the roots of the fins are fixed , and finally flatten the surface of the base. It can also be processed by a welding process. The advantages are high heat dissipation efficiency, small device size and low cost.
2. Copper skived heatsink
Copper skived heatsink by using a copper profile to make the copper base and copper fin. To skiving the full copper material into a thin or straight or spiral or wave fin high-conductivity product, and without any connection point, heat conduction efficiency can reach 100% of the material. The skived fin can make the heat sink thinner and improve the heat dissipation efficiency. The skving process can achieve several times of the thermal conductivity of the common extruded material in a specific size, and the processing process is simple.
3. Copper stamping heatsink
The copper fin can be stamped into the desired shape. Usually used in traditional air-cooled electronic devices, it is often used to provide an inexpensive way to dissipate heat for devices with low heat. Due to the use of advanced molds and high-speed stamping technology, stamped fin heat sinks are ideal for mass production.