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Stamped Fin Heat Sink

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For customers with electronics production requirements that require innovative and cost-effective approaches to a variety of thermal application designs, using of stamped fin heat sink is often the best option. Taking the advantage of stamping fin technology, manufacturers of these devices are able to configure the heatsink fins in a variety of shapes and sizes. These stamped fin heat sinks are made of copper and aluminium, which are the most common heat sink materials, and the aluminium stamped fin heat sinks are usually made of AL6063 aluminium alloy, which produces a high thermal conductivity of about 200 W/(mK). Copper stamping fin heat sinks are usually manufactured using the C1100, which produces thermal conductivity up to ~ 400 W/(mK). Not only can these heat sink be manufactured with extremely light weight, but also they can be used for medium to high capacity operations. By far, one of the best features is its extreme efficiency, which makes it ideal for the smallest size of packaging.


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Advantages of stamped fin heat sink


The stamped fin heat sink has been able to achieve significant improvements over conventionall heat sink design, including a range of features ranging from extreme fin thickness to high density, from limited restrictions for fin height to strong compatibility with external accessories when needed. The thinness of fins can achieve with stamped fin heat sink technology is dramatically more advanced than conventional extruded heat sink

While skiving fin technique can bring extrusions down to just under a fifth of an inch, stamping fin techniqueis able to double the thinness. This is very useful for attaining the large surface area needed to effectively disperse thermal energy from the heat sink.


Stamped fin heatsink design


Stamped fin heat sink provides the much needed thermal solutions for a variety of applications. First, the combination of copper, aluminum, and sometimes even need nickel plating, has a special response to the cooling requirements of ultra-high performance computer, such as overclocked computer, when designing a stamping fin heat sink. Other uses of the stamped fin heat sinks include forced convection currents, high power chips, usually more than 100 watts, and small, difficult-to-fit space requirements. The stamped fin heatsink technology offers a good approach for producing high efficiency, high aspect ratio, lightweight heatsinks in small package sizes, and is a good choice for medium to high volume production. This  technology also offers a low Non Recurring engineering charge, so prototype set up costs are minimal.

For maximum flexibility heat sink design, stamped fin heat sink can be stamped into a wide range of geometry shape and thickness. Stamped fin heat sink technology provides a good method to producing efficiency, high aspect ratio, light weight heat sink in small package sizes , and is in the ideal choice for medium to high volume production. This stamped fin technique also provides a low non recurring engineering charge, so prototype set up costs are minimal.

 


The manufacturing process of stamping fin heat sink


A stamping fin heat sink can usually be identified by a zipper fin plate that holds the stamped fins in place, and it is usually easy to see that the heatsink is two parts - the base and the stamping fin.

The stamped fin heat sinks are fabricated using a stamping process where metal sheets of aluminum or copper are stamped into a particular configuration based on the application. These zipper fins are manufactured during the stamping process to form interlocking fins. The zipper fin heat sinks can increase  the strength of the stamped fin heat sink, and can allow the stamping fins to have different shapes. The stamped fins are then smoothed with a sanding belt, and these stamped fins are then attached to a heat sink base typically using solder. 

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