The heatsink installed on BGA device are called BGA heatsink, but they are actually simple aluminum extruded heatsink design to cooling the BGA device. Lori currently has extensive BGA heat sink ,wihich have various sizes, fin types.

In today's information age, people have more and more requirements on functions and performance of electronic products, while the volume requirements are smaller and the weight requirements are lighter and lighter. BGA's advanced high density packaging technology promotes the realization of the development goal of electronic products towards multi-function, high performance, miniaturization and lightening. So BGA heat sink is very small, and the attachment of the heat sink is a big challenge. Currently, the heat sink can be either attached to the device or to the PCB boards in a variety of ways, including clip connections, solder anchors, push pins, hot tape/epoxy resins, and easy to assemble tape, etc. Hot tape/epoxy resins are a common method for quick and easy installation to your equipment.

Bga heat sink have various type, such as Bga extruded fin heatsink ,Bga aluminum extruded fin heatsink,Bga aluminum round pin heatsink,Bga aluminum square pin fin heatsink,Bga aluminum copper pin heatsink,Bga fan heatsink, Bga plate fin heat sink, Bga push pin heat sink, Bga heat sink with cross cutting, etc.

Features:

1. Aluminum BGA  heat sink is low profile.

• 2. high efficiency cooling product which is ideal for linear air flow environments.
• 3. made from thermal conductivity 6063-T5 aluminum for optimum heat transfer
• 4. Designed specifically for BGA and other surface mount packages
• 5. Finished with black or silver anodized.