Lori heat sink designed for BGA package
Lori provide a new cooling solution for IC with ball gate array (BGA) packaging. The new BGA heat sink is targeted at traditional high capacity motherboards, video CARDS and networking card applications.
Lori company provides standard and OEM BGA cooling solutions. Low-end customized products include accessories, interface materials and fans selected by customers. Other customization services include decorative and structural modifications to fins, as well as tagging and graphics.
The company also supports BGA emerging markets such as personal computers and consumer electronics products with high-end design optimizations that meet thermal performance requirements and brand objectives such as providing OEM customers with images that reflect the company or brand.
In addition, the company supports existing OEM designs that integrate BGA packaging with thermal solutions for graphics and mechanical design services, thermal analysis, mechanical analysis, thermal detection and fan life detection.For customers in the early stages of design, Lori offers design engineering support, testing equipment, and full prototyping capabilities to ensure rapid design cycles.
Bga heatsink type and features
Bga heat sink have various type, such as Bga extruded fin heatsink ,Bga aluminum extruded fin heatsink,Bga aluminum round pin heatsink,Bga aluminum square pin fin heatsink,Bga aluminum copper pin heatsink,Bga fan heatsink, Bga plate fin heat sink, Bga push pin heat sink, Bga heat sink with cross cutting, etc.
1. Aluminum BGA heat sink is low profile.
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