Bga Heat Sink 40.5x40.5x10mm
1. Dimensions: 40.5x40.5x11mm, can be customized.
2. Diagonal hole distance: 59mm
3. Product materials: High thermal conductivity 6063-T5 aluminum
4. Process: Aluminum extrusion processing, Cross Cutting
5. Finish: Anodizing Black, can be customized
6. Application: Electronic Motherboard chip cooling
7. weight: 20g
8. Installs Way: Buckle
If you need design and customization Bga heat sink, please contact our sales! Dimension can be customized according to customer needs. Color can be customized in black or white.
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