|Place of Origin:||Shenzhen, China (Mainland)||Width||35 mm|
|Process:||Push pin||Height||10 mm|
|Packing:||Carton, Blister tray, Wooden pallet||Brand Name: ||LORI|
|Model Number:||SR9321||Tolerance:||0.01 mm|
|Finish:||Black Anodied||Quality control:||100% quality inspection|
|Extra process:||CNC Machining, Cross cutting||Size:||Can be customized|
35x35x10mm Bga Heat Sink, Aluminum, Push pin
Aluminum push pin BGA heatsink is low profile, high efficiency cooling product which is ideal for linear air flow environments and has use thermal conductivity 6063-T5 aluminum as material. The Bga heat sink is designed to cooling BGA chipsets.These devices mount with clip to provide optimum cooling at a very competitive price. Lori is a BGA heat sink manufacturer, we can provice customer standard BGA heat sink in stock, also we welcome to custom BGA heat sink, or other heatsinks, liquid cold plate, Please contact our teams to learn more!
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