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Aluminum Push Fin Bga Heatsink 35x35x10mm

Aluminum Push Fin Bga Heatsink 35x35x10mm

Bga heatsink
Brand Name
Model Number
Place of Origin
Shenzhen, China (Mainland)
Carton, Blister tray, Wooden pallet
Bga Device
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15days after payment
Quality Guarantee
1 year
Place of Origin:Shenzhen, China (Mainland)Width35 mm
Process: Push pin Height10 mm
Material: AL6063Shape:Square
Packing:Carton, Blister tray, Wooden palletBrand Name:
Application:BGAlength35 mm
Model Number:SR9321Tolerance:
0.01 mm
Finish:Black AnodiedQuality control:100% quality inspection
Extra process:CNC Machining, Cross cuttingSize:Can be customized
Product Description
Bga Heat Sink

35x35x10mm Bga Heat Sink, Aluminum, Push pin 

Aluminum push pin BGA heatsink is low profile, high efficiency cooling product which is ideal for linear air flow environments and has use thermal conductivity 6063-T5 aluminum as material. The Bga heat sink is designed to cooling BGA chipsets.These devices mount with clip to provide optimum cooling at a very competitive price.  Lori is a BGA heat sink manufacturer, we can provice customer standard BGA heat sink in stock, also we welcome to custom BGA heat sink, or other heatsinks, liquid cold plate, Please contact our teams to learn more!

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