| Place of Origin: | Shenzhen, China (Mainland) | Width | 35 mm |
| Process: | Pushi pin | Height | 10 mm |
| Material: | AL6063 | Shape: | Square |
| Packing: | Carton, Blister tray, Wooden pallet | Brand Name: | LORI |
| Application: | BGA | length | 35 mm |
| Model Number: | SR9321 | Tolerance: | 0.01 mm |
| Finish: | Black Anodied | Quality control: | 100% quality inspection |
| Extra process: | CNC Machining, Cross cutting | Size: | Can be customized |
50x50x10mm Bga Heat Sink, Aluminum, Plate pin
Aluminum BGA plate fin heatsink is low profile, high efficiency cooling product which is ideal for linear air flow environments and has use thermal conductivity 6063-T5 aluminum as material. The Bga heatsink is designed to cooling BGA chipsets.The device mount with clip to provide optimum cooling at a very competitive price. Lori is a BGA heatsink manufacturer, we can provice standard BGA heat sink to customer , also welcome to custom BGA heat sink, or other heatsinks, liquid cold plate. Please contact our teams to learn more!
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E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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