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Bga Plate Fin Heatsink Aluminum 50x50x10mm

Bga Plate Fin Heatsink Aluminum 50x50x10mm

Bga heatsink
Brand Name
Model Number
Place of Origin
Shenzhen, China (Mainland)
Carton, Blister tray, Wooden pallet
Bga Device
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15days after payment
Quality Guarantee
1 year
Place of Origin:Shenzhen, China (Mainland)Width35 mm
Process: Pushi pin Height10 mm
Material: AL6063Shape:Square
Packing:Carton, Blister tray, Wooden palletBrand Name:
Application:BGAlength35 mm
Model Number:SR9321Tolerance:
0.01 mm
Finish:Black AnodiedQuality control:100% quality inspection
Extra process:CNC Machining, Cross cuttingSize:Can be customized
Product Description
Bga Heat Sink

50x50x10mm Bga Heat Sink, Aluminum, Plate pin 

Aluminum BGA plate fin heatsink is low profile, high efficiency cooling product which is ideal for linear air flow environments and has use thermal conductivity 6063-T5 aluminum as material. The Bga heatsink is designed to cooling BGA chipsets.The device mount with clip to provide optimum cooling at a very competitive price.  Lori is a BGA heatsink manufacturer, we can provice standard BGA heat sink to customer , also welcome to custom BGA heat sink, or other heatsinks, liquid cold plate. Please contact our teams to learn more!

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