|Place of Origin:||Shenzhen, China (Mainland)||Width||25 mm|
|Process:||Plate pin||Height||10 mm|
|Packing:||Carton, Blister tray, Wooden pallet||Brand Name: ||LORI|
|Model Number:||SR9325||Tolerance:||0.01 mm|
|Finish:||Black Anodied||Quality control:||100% quality inspection|
|Extra process:||CNC Machining, Cross cutting||Size:||Can be customized|
25x25x10mm Bga Heat Sink, Aluminum, Cross cut Type
Aluminum cross cut type BGA heatsink is low profile, high efficiency cooling product which is ideal for the linear air flow environments and has use thermal conductivity 6063 aluminum as material. The Bga heatsinks are designed to cooling BGA chipsets.These devices mount with clip to provide optimum cooling at a very competitive price. Lori as a BGA heat sink manufacturer, we can provice customer standard BGA heat sink in stock, also we welcome to custom BGA heatsinks, or other heatsinks, liquid cold plate, Please contact our teams to learn more!
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