| Place of Origin: | Shenzhen, China (Mainland) | Width | 20 mm |
| Process: | Aluminum extrusion processing | Height | 10 mm |
| Material: | AL6063 | Length: | 20 mm |
| Packing: | Carton, Blister tray, Wooden pallet | Brand Name: | LORI |
| Application: | BGA Chip | Shape: | Square |
| Model Number: | SR9324 | Tolerance: | 0.01 mm |
| Finish: | Black Anodied | Quality control: | 100% quality inspection |
| Extra process: | CNC Machining, Cross cutting | Size: | Can be customized |
20x20x10mm Aluminum Bga Heat Sink Cross cut Type
Aluminum BGA heatsink cross cut type is low profile, high efficiency cooling product which is ideal for linear air flow environment and has use thermal conductivity 6063 aluminum as material. The Bga heat sink is designed to cooling BGA chip.These devices mount with clip to provide optimum cooling at a very competitive price. Lori as a BGA heatsink manufacturer, we can provice customer standard BGA heatsinks in stock, also we welcome to custom BGA heatsinks, or other heat sinks, liquid cold plate, Please contact our teams to learn more!
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E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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