BGA Heat Sink 

Pure Copper Skived Fin And  CNC Processing Heat Sinks
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Ball Grid Array (BGA) is used to cool integrated circuits, and the device encapsulated by this technology is a surface mount device. BGA packaging appeared in the early 1990s, and has developed into a mature high-density packaging technology. Lori provides a series of BGA heatsink and thermal solutions for cooling IC and IC with ball gate array (BGA) surface mount packaging. 

Bga heatsink are so named because they are mounted on a bga devices, but are actually just simple heatsink extrusions. bga heatsink are usually cross-cut converted extruded fins into pins, allowing them to be used in a wider range of applications.The number and size of crosscuts depends on the environment. Because bga heatsink are generally small, the attachment of the heat sink is a challenge.The bga heatsink can be either attached to the device  or to the PCB, depending on the application and mechanical requirements. Thermal tape/epoxy is a commonly  method, usually associated with low power devices.While not the best thermal interface materials, they can achieve their purpose.

Customers choose Lori’s BGA heat sink options when they need reliable cost effective standard cooling solutions. Lori's BGA heat sinks are made from high conductivity extruded aluminum, 6063-T5, Lori’s high quality BGA heatsinks handle even the most demanding applications. You can select from a variety of sizes, shapes for the best cooling solution. If you don’t find what you need in the standard options, Lori offers a custom BGA heat sink design service to meet all your cooling requirements.




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