Ball Grid Array (BGA) is used to cool integrated circuits, and the device encapsulated by this technology is a surface mount device. BGA packaging appeared in the early 1990s, and has developed into a mature high-density packaging technology. Lori provides a series of BGA heatsink and thermal solutions for cooling IC and IC with ball gate array (BGA) surface mount packaging. 

Bga heatsinks are so named because they are mounted on a bga devices, so the heatsink installed on BGA device are called BGA heatsink, but they are actually simple aluminum extruded heat sink design to cooling the BGA device. bga heatsinks are usually cross-cut converted extruded fins into pins, which also know as cross fin heat sink , allowing them to be used in a wider range of applications. The number and size of crosscuts depends on the environment.

Lori currently has extensive BGA heat sink ,wihich have various sizes, fin types. In today's information age, people have more and more requirements on functions and performance of electronic products, while the volume requirements are smaller and the weight requirements are lighter and lighter. BGA's advanced high density packaging technology promotes the realization of the development goal of electronic products towards multi-function, high performance, miniaturization and lightening.

So bga heatsinks are generally small, and the attachment of the heat sink is a big challenge.The bga heat sink can be either attached to the device  or to the PCB, depending on the application and mechanical requirements. Thermal tape/epoxy is a commonly method, usually associated with low power devices. While not the best thermal interface materials, they can achieve their purpose. Currently, the heat sink can be either attached to the device or to the PCB boards in a variety of ways, including clip connections, solder anchors, push pins, hot tape/epoxy resins, and easy to assemble tape, etc. depending on the application and mechanical requirements, hot tape/epoxy resins are a common method for quick and easy installation to your equipment. Usually associated with low power devices. While not the best thermal interface materials, they can achieve their purpose.

Customers choose Lori’s BGA heat sink options when they need reliable cost effective standard cooling solutions. Lori's BGA heat sinks are made from high conductivity extruded aluminum, 6063-T5, Lori’s high quality BGA heatsinks handle even the most demanding applications. You can select from a variety of sizes, shapes for the best cooling solution. If you don’t find what you need in the standard options, Lori offers a custom BGA heat sink design service to meet all your cooling requirements.