The bga heatsink is square pin fin board level heat sink designed to cool bga devices and mounting on the device by thermal conductive pad, this bga heat sink is just simple extruded heatsink with black anodized. bga heatsink are usually grooving converted extruded fins into pins, allowing them to be used in a wider range of applications.The number and size of grooving depends on the environment. the bga heat sink are very small and measures 20 mm length x 14 mm width x 10mm height. The bga heatsink can be either attached to the BGA device  or to the PCB.