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Bga Heatsink Aluminum From Lori

Bga Heatsink Aluminum From Lori

Bga heatsink
Brand Name
Model Number
Place of Origin
Shenzhen, China (Mainland)
Paper carton with wooden pallet
Bga Device
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15days after payment
Quality Guarantee
1 year
Place of Origin:Shenzhen, China (Mainland)OEM:Yes
Packing:Standard export PackingBrand Name:
Application:TelecomCertificate:ISO 9001:2015,ISO 14001:2015
Model Number:LR0139Tolerance:
0.01 mm
Finish:Black Andoized
Size:20mmx14mm x10mm
Extra process:Coss Cutting &CNC Machining

Applied Field:BGA devices

Product Introduction

The bga heatsink is square pin fin board level heat sink designed to cool bga devices and mounting on the device by thermal conductive pad, this bga heat sink is just simple extruded heatsink with black anodized. bga heatsink are usually grooving converted extruded fins into pins, allowing them to be used in a wider range of applications.The number and size of grooving depends on the environment. the bga heat sink are very small and measures 20 mm length x 14 mm width x 10mm height. The bga heatsink can be either attached to the BGA device  or to the PCB.                

Product Details

Product Application
Applied to BGA device, FPGA device and PCB.
After Sales Instructions

 In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:

 1.Provide online technical support for customers, and provide consulting services on related issues

 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please  contact with us in time. After checking and coordinating, we can return and replace the products in time.

Product Message
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