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The use of heat sink to increase the area of heat dissipation is the most common and basic method in thermal management technology. With the increasing trend of heating density of electronic devices, the demand for heat dissipation is increasing day by day, the difficulty of heat sink design is increasing, and the cost is increasing. Although heat sink new processes and design techniques continue to improve, the use of heat sinks in limited space seems to be reaching its limits. In the future, various cooling technologies such as water cooling, refrigeration cycle and immersion boiling cooling may be used to solve the heat dissipation problem. In spite of this, the heat sink is still the most economical and reliable way to dissipate heat. Therefore, in order to meet the demand of future electronic heat dissipation, the shape, materials and manufacturing process of the heat sink must be updated with new technology. In addition, the integration of other heat sink design methods can also increase the efficiency of application.