Professional High Power Cooling Solution Service Provider And Heat Sink Manufacturer

High performance heat sink

High Performance Heat Sink

In modern power electronics assemblies, such as components found in drive systems or frequency converters, the performance increases with the increase of surface area. As a result, more heat is produced, which must be dissipated to protect the electronics from degradation or damage. To this end, we optimize the production process, design and produce high performance and efficient heat sink, such as bonded fin heat sink, stacked fin heat sink, water cooling heat sink, and combined with the fan or heat pipe, installed in the electronic equipment, can achieve rapid heat dissipation.

Lori is one of the manufacturers of cooling solutions for space, flight, power industry, electron, military,communications, and so on. Our main goal is to design suitable solutions for the challenging thermal applications of power electronics and mechanical development engineers. 

For air cooling, heat dissipation with or without a fan is achieved through extended surfaces called fins.For liquid cooling, a specially designed internal cooling circuit is used to remove the heat. The heat pipe can be used to upgrade the air-cooled design to liquid cooling performance.The reliability and service life of each electronic circuit depends on the operating temperature, which highlights the importance of adequate and high performance cooling.

 

Different types of high performance heat sinks

The following is an introduction to our different types of high performance heat sinks.

High performance liquid cooling plate

For optimal thermal heat sink cooling performance, Lori offers a full range of liquid cooled heat sink and cold plate design applications that can meet your high power needs.With today's smaller and more powerful power equipment, liquid cooling has become the best thermal soluion. Packaging can be compact, less noisy, and semiconductors can be expected to a longer life due to lower operating temperatures.

High perfermance Bonded fin heat sink

Lori can offer customers complete freedom in the design and manufacturing of our Bonded fin heat sinks. Each bonded heat sink is built to meet the specific needs of customer. For bonded fin vs extruded, the bonded fin heat sink can dissipate two – three times more heat than the average extruded heat sink by adding 200% to 300% to the cooling surface area. There are two fin styles – folded fin and single fin. Fin height, fin thickness and fin density can be used in myriad combinations to get the heat sink performance of your customers deserve.

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