In modern power electronics assemblies, such as components found in drive systems or frequency converters, the performance increases with the increase of surface area. As a result, more heat is produced, which must be dissipated to protect the electronics from degradation or damage. To this end, we optimize the production process, design and produce high performance and efficient heat sink, such as bonded fin heat sink, stacked fin heat sink, water cooling heat sink, and combined with the fan or heat pipe, installed in the electronic equipment, can achieve rapid heat dissipation.
Lori is one of the manufacturers of cooling solutions for space, flight, power industry, electron, military,communications, and so on. Our main goal is to design suitable solutions for the challenging thermal applications of power electronics and mechanical development engineers.
For air cooling, heat dissipation with or without a fan is achieved through extended surfaces called fins.For liquid cooling, a specially designed internal cooling circuit is used to remove the heat. The heat pipe can be used to upgrade the air-cooled design to liquid cooling performance.The reliability and service life of each electronic circuit depends on the operating temperature, which highlights the importance of adequate and high performance cooling.
Different types of high performance heat sinks
The following is an introduction to our different types of high performance heat sinks.