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What is Direct Liquid Cooling (DLC)?

Driven by artificial intelligence (AI), high-performance computing (HPC), and increasingly powerful CPUs/GPUs, the rapid development of computing power has pushed traditional cooling methods to their limits. DLC represents the most direct and efficient level of liquid cooling. Direct liquid cooling, also known as direct chip liquid cooling, uses cold plates to apply liquid coolant directly to the primary heat-generating surfaces of semiconductor chips and other critical components (CPUs, GPUs, ASICs, memory).

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How Direct Liquid Cooling Works at the Component Level

Precision microchannel cold plate

A specially designed microchannel cold plate is directly mounted onto the processor chip and other high-power components, maximizing the elimination of thermal resistance from traditional integrated heat sinks (IHS) and thermal interface materials (TIM). Lori liquid cold plate uses advanced materials and micro-fin structures to achieve maximum contact surface area.

Chip-level contact

Coolant flows through these microchannels, absorbing heat at the source.

Sealed loop

Heated coolant is pumped through sealed pipes to the coolant distribution unit (CDU) or heat exchanger, where heat is efficiently dissipated into the facility's cooling loop or ambient air.

Coolant recirculation

The cooled coolant then circulates back to the cold plate, completing the loop cycle.

Essentially, DLC removes heat at the source, significantly shortening the heat conduction path and maximizing efficiency.

The Significant Advantages of Direct Liquid Cooling

3. Achieve Ultra-high Density and Unlock AI/GPU Potential

· Cooling equipment that air cooling cannot handle: DLC is the only practical solution for dense GPU servers, AI training clusters, and high-end HPC nodes (with restricted airflow and extremely high thermal density, up to 100 kW+/cabinet).

· Smaller footprint: Higher cabinet density reduces the physical data center space required to deliver the same computing power.

4. Reduce Noise Pollution

Eliminating server fans creates a significantly quieter data center environment, improving working conditions and potentially enabling deployment in noise-sensitive areas.

5. Enhanced sustainability

· Reduced carbon footprint: The significant reduction in energy consumption directly translates to lower carbon dioxide emissions.

· Minimal water usage (closed-loop system): Combined with closed-loop architecture and efficient dry coolers/insulation systems for heat dissipation, water usage is minimized compared to traditional chillers or open-loop cooling towers.

1. Unmatched Thermal Performance and Higher Component Frequencies

· Exceptional Heat Dissipation Capability: Direct contact enables DLC to handle significantly higher heat flux (watts per square centimeter), which is critical for modern high TDP (thermal design power) chips such as NVIDIA H100/H200 GPUs and Intel/AMD high-core-count CPUs.

· Lower junction temperature (Tjunc): By dissipating heat more efficiently, DLC significantly reduces core temperatures, minimizing thermal throttling incidents and enabling sustained peak performance or even potential overclocking space.

· Enhanced stability and reliability: Components operating at lower temperatures experience reduced thermal stress, thereby extending lifespan and lowering failure rates.

2. Significant Energy Savings and Lower PUE

· Eliminate server fans: DLC eliminates the need for power-consuming, noisy server fans, which typically account for 10-25% of a server's total power consumption.

· Reduced data center air conditioning (CRAC/CRAH) load: By directly removing >70-95% of IT thermal load via liquid cooling, the burden on room-level air conditioning (CRAC/CRAH units) is significantly reduced or even eliminated, thereby cutting overall facility cooling energy consumption.

· Support for higher coolant inlet temperatures: The DLC system can operate effectively at coolant inlet temperatures as high as 40-45°C or even higher, maximizing the use of natural cooling (air-side or water-side energy-saving technologies) throughout the year, pushing the PUE to an ideal value of <1.05.

The Key Application Areas of Direct Liquid Cooling

DLC is no longer limited to niche scenarios; it is becoming a key infrastructure in the following fields

AI and machine learning training clusters

GPU-intensive servers are the driving force behind AI, generating significant and concentrated heat. DLC is crucial for training larger models more quickly and reliably.

High-performance computing (HPC)

The cutting-edge supercomputers and research clusters that drive the boundaries of simulation and modeling require DLC to achieve the highest performance and efficiency on a large scale.

High-density clouds and ultra-large-scale data centers

As cloud service providers deploy next-generation computing instances (especially GPU-accelerated ones), they are increasingly adopting DLC to manage power density and total cost of ownership (TCO).

Enterprise AI workloads and GPU-accelerated databases

Enterprises that run intensive internal AI inference, data analysis, or financial modeling on GPU servers can benefit from the stability and efficiency of DLC.

Edge computing and modular data centers

DLC enables the deployment of more computing power in space-constrained edge sites or modular units, while effectively managing heat.

Server Liquid Cooling Component Stainless and Copper Manifold

Server Liquid Cooling Loop Direct to Chip Vacuum Brazing Cold Plate

High-Performance Copper Quick Disconnect for Server Liquid Cooling Systems

Stainless Steel and Copper Server Memory DIMM Liquid Cooler

Why choose LORI's direct liquid cooling solution?

At LORI, we not only offer DLC components; we also provide end-to-end, optimized and reliable DLC systems specifically designed for practical deployment:

1.Verified high-performance cold plate technology: Advanced microchannel design: The cold plate design maximizes heat transfer efficiency and minimizes pressure drop. Wide compatibility and customized solutions: Supports mainstream OEM server platforms (Dell, HPE, Lenovo, Supermicro) and leading CPU/GPU suppliers (Intel, AMD, NVIDIA). Custom cold plates can be provided for proprietary or special hardware. Sturdy and leak-proof: Precise manufacturing and rigorous testing ensure reliability at key component interfaces and prevent leakage. 2. End-to-end system expertise and support: From design to production: LORI offers comprehensive support, including thermal simulation and modeling, prototype production and sample manufacturing, and mass production of products. Global service and maintenance: Provide expert technical support and maintenance plans to ensure continuous peak system performance and uptime. Future-oriented architecture: Our cooling components are designed with high compatibility and are