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Heatsink for Bga Device Aluminum From Lori

Heatsink for Bga Device Aluminum From Lori

Bga heatsink
Brand Name
Model Number
Place of Origin
Shenzhen, China (Mainland)
Paper carton with wooden pallet
Bga Device
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15days after payment
Quality Guarantee
1 year
Place of Origin:Shenzhen, China (Mainland)OEM:Yes
Packing:Standard export PackingBrand Name:
Application:BGACertificate:ISO 9001:2008,ISO 14001:2004
Model Number:LR0140Tolerance:
0.01 mm
Finish:Black Andoized
Size:12mmx12mm x10mm
Extra process:Cutting &CNC Machining

Applied Field:BGA devices

Product Introduction

The bga heat sink is square pin fin board level heat sink designed to cool BGA devices.They are very small and measures 12 mm length x 12 mm width x 10m height. this heat sink is just simple extruded heat sink with black anodized. bga heatsink are usually grooving converted extruded fins into pins, allowing them to be used in a wider range of applications.The number and size of grooving depends on the environment. 

Product Details

Product Application

Applied to Bga device and FPGA device, monting direction is horizontal, vertical.

After Sales Instructions

 In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:

 1.Provide online technical support for customers, and provide consulting services on related issues

 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please  contact with us in time. After checking and coordinating, we can return and replace the products in time.

Product Message
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