|Place of Origin:||Shenzhen, China (Mainland)||OEM:||Yes|
|Packing:||Standard export Packing||Brand Name: ||LORI|
|Application:||BGA||Certificate:||ISO 9001:2008,ISO 14001:2004|
|Model Number:||LR0140||Tolerance:||0.01 mm|
|Finish:||Black Andoized||Size:||12mmx12mm x10mm|
|Extra process:||Cutting &CNC Machining|
|Applied Field:||BGA devices|
The bga heat sink is square pin fin board level heat sink designed to cool BGA devices.They are very small and measures 12 mm length x 12 mm width x 10m height. this heat sink is just simple extruded heat sink with black anodized. bga heatsink are usually grooving converted extruded fins into pins, allowing them to be used in a wider range of applications.The number and size of grooving depends on the environment.
Applied to Bga device and FPGA device, monting direction is horizontal, vertical.
◪ In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:
◪ 1.Provide online technical support for customers, and provide consulting services on related issues
◪ 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please contact with us in time. After checking and coordinating, we can return and replace the products in time.
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