|Place of Origin:||Shenzhen, China (Mainland)||OEM:||Yes|
|Packing:||Standard export Packing||Brand Name: ||LORI|
|Application:||Telecom||Certificate:||ISO 9001:2008,ISO 14001:2004|
|Model Number:||LR0138||Tolerance:||0.01 mm|
|Finish:||Natural Andoized||Size:||45mmx40mm x16mm|
|Extra process:||Cutting &CNC Machining|
|Applied Field:||BGA devices|
The bga heatsink is square pin fin heat sink designed to cool bga devices and mounted on bga devices. the bga heatsink are very small and measures 28 mm length x 28 mm width x 20 mm height. This heatsink is just simple extruded heatsink with natural anodized. bga heat sink are usually cosscut converted extruded fins into pins, allowing them to be used in a wider range of applications.The number and size of cosscuttings depend on the environment and application.
Lori BGA heat sink usually applied to cooling BGA,FPGA devices , and mounting direction is horizontal and vertical
◪ In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:
◪ 1.Provide online technical support for customers, and provide consulting services on related issues
◪ 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please contact with us in time. After checking and coordinating, we can return and replace the products in time.
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