|Place of Origin:||Shenzhen, China (Mainland)||OEM:||Yes|
|Packing:||Cartons & EPE||Brand Name: ||LORI|
|Application:||Bga||Certificate:||ISO 9001:2008,ISO 14001:2004|
|Model Number:||LR0133||Tolerance:||0.01 mm|
|Finish:||Black Andoized||Size:||28mmx28mm x20mm|
|Extra process:||Grooving &CNC Machining|
|Applied Field:||BGA devices|
The bga heat sink is square pin fin board level heat sink designed to mounted on bga devices and cool bga devices. this heat sink is just simple extruded heat sink with black anodized. bga heatsink are usually grooving converted extruded fins into pins, allowing them to be used in a wider range of applications.The number and size of grooving depends on the environment. the bga heat sink are very small and measures 28 mm length x 28 mm width x 20 mm height.
Bga heat sink is the one of most popular and cost efficient heat sink for customers ,The type of heat sinks have many benefits as below .
1.Fast, tool less application. Clip and heat sink can be attached within a few seconds.
2.More cheaper than cnc machined heat sink .
3.Can be easily removed within seconds and reapplied
4.Easy customization and lighter than copper, with obvious advantages.
The bga heat sink has a wide range of applications. Contact us for assistance in determining if this board level heat sink is right for your application.
◪ In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:
◪ 1.Provide online technical support for customers, and provide consulting services on related issues
◪ 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please contact with us in time. After checking and coordinating, we can return and replace the products in time.
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