| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Stamping | Cooling type | Passive |
| Material: | Vapor chamber + Aluminum fin | Shape: | Square |
| Packing: | Paper carton with wooden pallet | CPU Platform | Intel LGA4189 |
| Application: | Intel 1U server Processor | Power Dissipation: | 230 W |
| Model Number: | LGA4189-N17-HS | Fin Thickness: | 0.3mm |
| Extra process: | Soldering+CNC Machining | Fin Pitch: | 1.5 mm |
| Product environmental compliance | RoHS and REACH compliant | Dimensions : | L 113*W 78*H 25 mm |
Lori 1u server passive heatsink is designed for Intel xeon gold processor FCLGA4189 processors. The fclga 4189 heatsink is custom-designed contact surface for LGA4189 platforms, dedicated version for the Intel LGA4189 socket. The fclga 4189 cpu passive heatsink is aluminum fins with vapour chamber cooling for for 1U server cooling solution, support 230W cpu power heat dissipation. The intel fclga 4189 socket cpu passive heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.
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E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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