Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
Process: | Pure Skiving | Cooling type | Passive |
Material: | Copper base + Copper Skived fin | Shape: | Square |
Packing: | Paper carton with wooden pallet | CPU Socket: | LGA2011/2066/1156 Narrow |
Application: | 1U Server Intel CPU, IPC box, Computer | Power Dissipation: | 100 W |
Model Number: | LGA2011 | Fin Thickness: | 0.35mm |
Finish: | Passivating, Nickel plating | Fin Pitch: | 1.9 mm |
Extra process: | Skiving+CNC Machining | Size: | L80*W80*H23mm |
Product environmental compliance | RoHS and REACH compliant |
1U Server Passive Pure Copper skived fin heatsink
This Server Passive Copper heatsink is 1U server passive solution for 1U Server Intel Narrow Cpu LGA2011/2066/1156. Material included copper skived fins, copper base The Server Passive Copper heatsink has been 100% tested and validated by Lori to ensure the best quality and cooling performance.
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