| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Stamping | Cooling type | Passive |
| Material: | Vapor chamber + Copper fin | Shape: | Square |
| Packing: | Paper carton with wooden pallet | CPU Platform | Intel LGA4189 |
| Application: | Intel 1U server Processor | Power Dissipation: | 240 W |
| Model Number: | LGA4189-D72-HS | Fin Thickness: | 0.3mm |
| Extra process: | Soldering+CNC Machining | Fin Pitch: | 1.5 mm |
| Product environmental compliance | RoHS and REACH compliant | Dimensions : | L 113* W 78 * H 25 mm |
3th Intel Xeon Scalable Processors 1U Server Lga 4189 CPU Copper Vapor Chamber Heatsink
The LGA 4189 socket cpu heatsink is designed for 1u 3th Intel xeon scalable processors Ice Lake and Cooper Lake Server Processor, LGA 4189 socket. Copper stacked fin soldered on the vapor chamber cooler for 1U server solution, support 240w CPU power heat dissipation. The 1u server copper heatsink has been fully tested and validated by Lori to ensure the best quality and cooling performance.
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E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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