This air to air semiconductor cooling heat sink module uses efficient natural convection technology and is designed for semiconductors to reduce their temperature. The cooling module is equipped with an efficient skiving fin heat sink and a heat pipe heat sink, and through natural convection, the heat generated by the semiconductor is quickly transferred through the upper and lower contact surfaces, ensuring stable operation of the system within the appropriate temperature range.

Semiconductor Cooling Heat Sink Module’s  Benifits: 

1. Modular Design   2.Isolation Seal   3.High Reliability   4.Compact Structure   5.Long Life   6.Customizable

Applications of skiving aluminum semiconductor's cooling heat sink modules are:

Laser, CNC, Medical, Detection