|Place of Origin:||Shenzhen, China (Mainland)||OEM:||Yes|
|Material:||Zipper fin + Vapor Chamber||Shape:||Square|
|Heat-dissipating mehthod||Passive Cpu cooling|
|Application:||Intel Processor||Certificate:||ISO 9001:2015, ISO14001:2015|
|Input voltage||DC 12V|
|Finish:||Passivation||Quality control:||100% thermal test|
|Extra process:||Stamping ||Size:||110*110*25mm|
This CPU vapor chamber heat sink is composed of vapor chamber and aluminum stamped fins , and the easiest way to combine them is to soldering vapor chamber to the bottom of the stamped fin heat sink. A more efficient method is to soldering a bunch of stamped fins directly to the surface of the vapor chamber. To improve dimensional integrity, these stamped fins are usually connected to each other by locking pieces called zipper fins. and applied to Intel processor heat dissipation.
We can custom all kinds of cpu heatsink, vapor chamber heat sink for customer. Welcome to contact us!
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