| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Soldering | Temper: | T3-T8 |
| Material: | Zipper fin + Vapor Chamber | Shape: | Square |
| Heat-dissipating mehthod | Passive cooling | LORI | |
| Application: | Intel Processor | Certificate: | ISO 9001:2015, ISO14001:2015 |
| Input voltage | DC 12V | Tolerance | 0.05 mm |
| Finish: | Passivation | Quality control: | 100% thermal test |
| Extra process: | Stamping | Size: | 90*90*22mm |
vapor chamber heatsink
This Passive CPU vapor chamber heat sink is composed of vapor chamber and aluminum zipper fin, which is made by soldering process, so it is also soldering heat sink, and applied to Intel processor heat dissipation.
We can custom all kinds of electronic heatsink, cpu heatsink for customer. Welcome to contact us!
PRODUCTS
CONTACT INFO
E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
CONTACT US
LEAVE A MESSAGE
Copyright © 2008 by Shenzhen Lori Technology Co.,Ltd. All Rights Reserved
Hello, please leave your name and email here before chat online so that we won't miss your message and contact you smoothly.
