| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Soldering | Temper: | T3-T8 |
| Material: | Zipper fin + Vapor Chamber | Shape: | Square |
| Heat-dissipating mehthod | Passive cooling | LORI | |
| Application: | Intel Processor | Certificate: | ISO 9001:2015, ISO14001:2015 |
| Input voltage | DC 12V | Tolerance | 0.05 mm |
| Finish: | Passivation | Quality control: | 100% thermal test |
| Extra process: | Stamping | Size: | 90*90*22mm |
This Passive CPU vapor chamber heat sink is composed of vapor chamber and aluminum zipper fin, which is made by soldering process, so it is also soldering heat sink, and applied to Intel processor heat dissipation.
We can custom all kinds of electronic heatsink, cpu heatsink for customer. Welcome to contact us!
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