Q1: What are the main advantages of your liquid cooling solution compared to traditional air cooling?

A: Our liquid cooling solution provides targeted cooling directly to heat-generating cores (such as CPUs/GPUs), achieving efficiency several times higher than air convection. 

This enables servers to sustain turbo frequencies at higher power levels, increasing compute density while significantly reducing overall data center energy consumption (PUE).

Q2: How does vacuum brazing differ from traditional welding?

A: Vacuum brazing occurs in an oxygen-free vacuum furnace, eliminating oxidation and impurities. It forms seamless, uniform, and high-strength metallurgical bonds without melting the base material. 

Compared to traditional welding, brazed joints are smoother with lower flow resistance and fundamentally eliminate the risk of micro-leaks, ensuring absolute circuit integrity during long-term operation.

Q3: Is this liquid cooling circuit “plug-and-play”?

A: Yes, we provide a highly integrated module. It is factory-tested as a complete unit designed to simplify your integration process. You receive a pre-assembled cooling circuit, significantly reducing the time 

and risk associated with manually assembling multiple components inside the server.

Q4: What is the design process for custom cold plates?

A: The process begins with close collaboration. You provide the mechanical layout of the target server and its Thermal Design Power (TDP) requirements. Our engineering team then creates 3D models, 

performs thermal simulations, and presents a customized cold plate design for your approval, ensuring perfect compatibility with your hardware.