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Heat Sink With Heat Pipe Laptop  On The Chipset From LORI

Heat Sink With Heat Pipe Laptop On The Chipset From LORI

Type
Heat Pipe Heat Sink
Brand Name
LORI
Model Number
LR0132
Place of Origin
Shenzhen, China (Mainland)
Packing
Paper carton with wooden pallet
Application
Telecommunication, UPS, inverters, controllers, wind power converters, and SVG
Payment
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15days after payment
Quality Guarantee
1 year
Parameter
Place of Origin:Shenzhen, China (Mainland)OEM:Yes
Process:SolderingTemper:T3-T8
Material:Heat pipe+Copper zipper fin+AL base+Fan Shape:Square
Packing:Paper carton with wooden palletBrand Name:
LORI
Application:laptop cpu, led
Certificate:ISO 9001:2008,ISO 14001:2004
Model Number:LR0132Tolerance:
0.01 mm
Finish:passivationQuality control:100% thermal test
Extra process:Stamping+CNC MachiningSize:145*80*35mm
Product Advantage

 

High power heat pipe heat sink advantages

The heat pipe heat sink assembly was able to effectively dissipate the 6kW of heat while maintaining the IGBT under their rated temperature limits. In comparison, the extrusion was not able to meet the requirements.

The thermal resistance of the heat sink is determined by the thermal conductivity of the material and the effective area within the volume. When the volume of a solid aluminum or copper heat sink reaches 0.006m cubed, increasing its volume and area does not significantly reduce the thermal resistance. For discrete semiconductor devices with dual cooling, the thermal resistance of air-cooled all-copper or all-aluminum radiator can only reach 0.04℃/W, while that of heat pipe radiator can reach 0.01℃/W.Under the condition of natural convection cooling, the performance of heat pipe heat sink can be improved more than ten times than that of solid heat sink.



Product Details

With heat pipe as the core, this heat pipe  thermal module, which is composed of heat sink, zipper fin and fan, can solve the heat dissipation problem caused by narrow space or too concentrated heat. The key parts is heat pipe that is an efficient heat conduction device made by using the principle of low pressure liquid phase change. Its heat transfer efficiency is dozens to hundreds of times that of traditional metals, can quickly take heat away from the heat source.

Production Process


Heat pipe heat sinks in the power electronics field can be classified as follows according to the techniques used:

Heat pipe+Profile   :Made from the base material of the thick tubular aluminum sleeve inserted into the fluid treatment tube, the aluminum fin material completely wraps the heat pipe , so there is no risk of electrical corrosion at the root of the fin (between the heat pipe and the fin). As the only interface between heat and cold sources, extruded fin heat pipe is the core of heat transfer. When the heat transfer capacity of the two liquids is far apart, fins or grooves can be used for heat exchange between the two liquids, and fins can be added to the surface in contact with air to increase the heat flux density between the two fluids.

Heat pipe+zipper fin heat sink

The fins are welded, made of stamping material aluminum or copper, and folded into a shape with interlocking slots.The folding fin can transfer high thermal energy and has more than 3000 different configurations. Larger surface area, more flexible design and more stable structure than extruded fins, allowing very high fin density and length-width ratio, thus increasing surface area and better cooling. Zipper fins also increase design flexibility, especially for pipes that integrate heat pipes, fans, or blowers


Heat pipe+Profile

Heat pipe+Skived Fin

Heat pipe+Bonded 

                  Heat pipe+Zipper fin heat sink

Heat pipe+Aluminum  plate 

Heat pipeCopper plate


Product Application

Heat pipe heat sink solved such as high power CPU, laptop CPU far end heat dissipation, mature technology, high reliability, the cost is also rapidly reduced with the growth of the consumption, the industry has begun to widely use at present. Some manufacturers in their high power consumption IC devices, high heat flux density modules and other applications have also adopted this kind of heat dissipation problem.

Applied laptop cpu, led

After Sales Instructions

 In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:

 1.Provide online technical support for customers, and provide consulting services on related issues

 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please  contact with us in time. After checking and coordinating, we can return and replace the products in time.

Product Message
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