| Place of Origin | Shenzhen, China (Mainland) | Size | 140*60*43mm （L*W*H） |
| Process | CNC Machining + Friction stir welding | Working Temperature | 5℃ ~ 40 ℃ |
| Material | Aluminum + Coppe tube | Working Humidity | 15% ~ 80% |
| VDC | 24VDC | Storage Temperature | -20℃ ~ 60 ℃ |
| Startup Current/ Working Current | 5.5A/4.5A | Storage Humidity | 15% ~ 80% |
| Cooling Capacity | 100W | Weight | 2.0kg |
| Applied Field | Semiconductor | ||
Product Details
This cooling module uses efficient liquid cooling technology and is designed for semiconductors to reduce their temperature. The cooling module is equipped with two liquid cold plates, and through liquid cooling, the heat generated by the semiconductor is quickly transferred through the upper and lower contact surfaces, ensuring stable operation of the system within the appropriate temperature range.
Semiconductor Chilling Plate Cooling Module’s Benifits:
1. Modular Design 2.Isolation Seal 3.High Reliability 4.Compact Structure 5.Long Life 6.Customizable
Applications of semiconductor's cooling modules are:
Laser, CNC, Medical, Detection
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CONTACT INFO
E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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