Lori Technology will attend the SC25 conference in St. Louis, showcasing high-performance thermal solutions specifically designed for AI and high-performance computing platforms. If you are involved in high-performance computing or data centers and require to build accelerator servers or other high-power systems, we would be delighted to meet with you to discuss your thermal solution planning.

Event Overview

Date: November 17-20, 2025

Location: U.S. Center Convention Center, St. Louis, Missouri

Booth: 4347

At SC25, experience our core thermal products and technological capabilities firsthand:

Custom Liquid Cooling Plates

Utilizing advanced design and manufacturing processes to achieve perfect contact with heat-generating components, maximizing thermal conductivity.

CPU Liquid Cold Plate

GPU Liquid Cold Plate

DIMM Cold Plate

Why Meet with LORI Technology?

End-to-end technical support from concept to mass production: We provide one-stop engineering support—from initial thermal simulation and design optimization to prototyping and system integration—along with test data and documentation.

Vertically integrated manufacturing for guaranteed performance and delivery: We independently design and precision-manufacture core cooling components like liquid cooling loops, plates, and manifolds. This ensures complete control over supply chain and product quality, delivering consistent performance and rapid delivery capabilities.

Data-Driven Quality Commitment: Equipped with comprehensive testing facilities, all cooling products undergo rigorous pressure and leak testing, precise flow and flow resistance testing, and reliable thermal performance validation to guarantee delivered product quality.

We welcome you to share your power curves, heat flux data, and other specifications—we will prepare tailored solutions in advance.

Contact Information

Email: sales@lori-cn.com

Mobile phone: +86 1371303014

See you in St. Louis.