A Vapor Chamber (VC) or vacuum chamber heat spreader operates on principles similar to those of heat pipes, but differs in its conduction method. While heat pipes conduct heat in a one-dimensional linear manner, heat in a vapor chamber is conducted across a two-dimensional surface, making it more efficient.

A uniform temperature plate is a metal vacuum chamber with capillary structures on its inner walls. When heat generated by a device is transferred from the device surface to the VC evaporation zone, the working fluid inside the chamber vaporizes under a certain vacuum level. This vaporization process causes rapid expansion of the volume. The vaporized working fluid quickly flows throughout the chamber due to minor pressure differences. When the vapor contacts an environment slightly cooler than its saturation temperature, it condenses back into a liquid, releasing the heat absorbed during evaporation. The condensed coolant then returns to the evaporation zone through the capillary structures, and this cycle continues within the chamber.

Characteristics and Application Scenarios of Uniform Temperature Plates:

VC uniform temperature plates (heat spreaders) are typically used in electronic products that require small size or quick high heat dissipation. They are currently used in 5G phones, servers, high-end graphics cards, etc., and are strong competitors to heat pipe cooling methods.

Characteristics of Uniform Temperature Plates:

The liquid at the bottom of the vacuum chamber absorbs the chip's heat, evaporates, and spreads within the chamber, conducting heat to the heat sink fins, then condenses back into liquid and returns to the bottom.

Advantages of Uniform Temperature Plates:

Heat is conducted over a two-dimensional surface, thus achieving very high cooling efficiency.

Disadvantages of Uniform Temperature Plates:

Copper surfaces are prone to natural oxidation, and material costs are high.