| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Soldering | Temper: | T3-T8 |
| Material: | Copper fin + Copper base | Shape: | Square |
| Heat-dissipating mehthod | Passive cooling | LORI | |
| Application: | Intel LGA2011 Narrow | Certificate: | ISO 9001:2015, ISO14001:2015 |
| Input voltage | DC 12V | Tolerance | 0.05 mm |
| Finish: | Passivation | Quality control: | 100% thermal test |
| Extra process: | Stamping | Size: | 107×82×25mm |
This Copper Cpu heatsink is composed of copper fin and copper base , which is made by soldering process, so it is also soldering heatsink, and applied to intel processor heat dissipation.
We can provide all kinds of standard and custom cpu heat sink for customer. Welcome to contact us!
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E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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