Heatpipe heatsinks has the following advantages:

(1) Fast thermal response speed, Its heat transfer capacity is more than 1,000 times greater than that of copper tubes of the same size and weight;

(2)  small size and light weight;

(3)  high heat dissipation efficiency, can simplify the heat dissipation design of electronic equipment, such as variable air cooling for self-cooling;

(4)  do not need external power supply, work without special maintenance;

(5)  has a good isothermal, thermal balance, the evaporation section and cooling section of the temperature gradient is quite small, can be approximately regarded as 0;

(6)  safe and reliable operation, does not pollute the environment.

With heatpipe as the core, Heatpipe heatsinks, which are composed of heat pipe, zipper fin and copper plate,and can solve the heat dissipation problem caused by narrow space or too concentrated heat . The zipper fin, made of stamping material aluminum, and folded into a shape with interlocking slots.The zipper fin can transfer high thermal energy and has more than 3000 different configurations. Larger surface area, more flexible design and more stable structure than extruded fins, allowing very high fin density and length-width ratio, thus increasing surface area and better cooling. Zipper fins also increase design flexibility, especially for pipes that integrate heat pipes, fans, or blowers.

Heatpipe heatsinks in the power electronics field can be classified as follows according to the techniques used:

Profile + heat pipe

Skived Fin + heat pipe

Inserts + heat pipes

Snap-fit fin + heat pipe

Aluminum & copper plate + heat pipe

Copper pipe heatsink solved such as high power CPU, laptop CPU far end heat dissipation, mature technology, high reliability, the cost is also rapidly reduced with the growth of the consumption, the industry has begun to widely use at present. Some manufacturers in their high power consumption IC devices, high heat flux density modules and other applications have also adopted this kind of heat dissipation problem.

Applied to Communication, UPS, inverter, controller, wind power converter, SVG telecommunication.

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