| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Skiving | Temper: | T3-T8 |
| Material: | Copper skiving fin | Shape: | Square |
| Heat-dissipating mehthod | Passive cooling | LORI | |
| Application: | Intel LGA115X | Certificate: | ISO 9001:2015, ISO14001:2015 |
| Input voltage | DC 12V | Tolerance | 0.05 mm |
| Finish: | Passivation | Quality control: | 100% thermal test |
| Extra process: | Stamping | Size: | 90×90×24.5mm |
This copper cpu heatsink material is copper, which is made by skiving fin process, so it is also skived heatsink, and applied to intel processor heat dissipation.
We can provide all kinds of copper cpu heat sink for customer. Welcome to contact us!
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Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
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