| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Soldering | Temper: | T3-T8 |
| Material: | Heat pipe+ AL+ Fan | Shape: | Square |
| Heat-dissipating mehthod | Passive cooling | 2 Ball | |
| Application: | Intel LGA2011 Narrow | Fan speed | 2500~7300±10%RPM |
| Input voltage | DC 12V | Fan termina | 2.54-4Pin |
| Finish: | Passivation | Quality control: | 100% thermal test |
| Extra process: | Stamping | Size: | 103.75*76.7*69mm |
This CPU heat sink is composed of heat pipe, fan and aluminum fin, which is made by soldering process, so it is also soldering heat sink, and applied to Intel heat dissipation.
We can custom all kinds of electronic heat sink, included cpu heat sink for customer. Welcome to contact us!
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