The channel design of liquid cold plates is influenced by several factors, including flow rate, inlet and outlet locations, flow path structure, and manufacturing technology. Effective flow channel design must balance heat dissipation requirements with temperature uniformity and flow resistance to ensure optimal performance. Uniform flow through each channel is crucial for maintaining even temperature distribution across the plate.
The following is a simple bending pipe liquid cold plate simulation for reference.
Liquid Cold Plate Design Requirements:
- Application: Heat dissipation for a dry IGCT three-level device.
- Heating Surface Diameter: 85mm.
- Power: 2.5KW.
- Thermal Resistance: With a water flow rate of 6LPM, the single-sided thermal resistance must be <12K/KW, and the double-sided thermal resistance must be <6K/KW. This ensures the highest point temperature on the radiator surface does not exceed the inlet water temperature by more than 30K.
- Flow Resistance: 0.6bar at 6LPM.
- Mechanical Requirements: Contact surface roughness <Ra0.8 and parallelism <0.04mm.
- Surface Treatment: Nickel coating >8μm.
- Inlet and Outlet: G3/8 fittings for D8 water pipes.
Simulation Design:
- Inlet Temperature: 40°C.
- Flow Rate: 6LPM.
- Heat Sink Surface Temperature: Up to 68.8°C.
- Flow Resistance: 0.61bar.
The simulation shows how flow resistance and thermal resistance vary with flow rates from 3LPM to 8LPM.
Appearance and Application:
Water-cooled plates are ideal for high-power density components such as lasers, servers, photovoltaic energy systems, medical equipment, and military devices, where strict temperature control is essential. Given their high value, conducting simulation analyses before manufacturing prototypes is crucial. Using FloEFD software for liquid cold simulations and a PROE model for grid division allows easy calculation and modification to meet specific thermal challenges.
Lorithermal specializes in providing custom high-performance liquid cooling solutions and comprehensive liquid cold plate services to address various complex thermal management needs.
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