| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Reflow soldering,Stamping | Cooling type | Active |
| Material: | Copper base + Cu zipper+3 heat pipes | Shape: | Narrow |
| Packing: | Paper carton with wooden pallet | CPU Socket: | LGA3647 Narrow |
| Application: | 1U Server Intel CPU, IPC box, Computer | Power Dissipation: | 165 W |
| Model Number: | LGA115X-1U | Electric voltage: | 12V |
| Finish: | Passivating, Nickel plating | Fan speed: | PWM 1500-6600RPM |
| Extra process: | CNC Machining | Noise level: | 64.0dBA (MAX) |
| Air volume: | 21.35CFM (MAX) | Bearing type | Two Ball |
| Fan plug: | 4pin PWM | Dimension: | 108mm*80mm*27.3mm |
| Product environmental compliance | RoHS and REACH compliant | ||
LGA 3647 1U Server Active Copper Heat Sink
This 1U Server Heat Sink is 1U server active solution for 1U Server Intel Narrow Cpu LGA3647. Material included Copper base, cu zipper,3 heat pipes, The 1U heat sink has been 100% tested and validated by Lori to ensure the best quality and cooling performance.
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E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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