What is an EV Battery Pack?An EV battery pack is the energy storage core unit of an electric vehicle, usually consisting of multiple battery modules connected in series or parallel, each containing tens to hundreds of lithium-ion battery cells (Cells). The battery pack provides stable and efficient power output for the vehicle by integrating thermal management system, battery management system (BMS) and structural protection components.Main Components of a Power Vehicle Battery Pack             A complete battery pack usually contains the following core components:1. Battery Cell (Cell)Lithium-ion batteries are the mainstream choice, responsible for storing and releasing electrical energy.2. Battery ModuleMultiple battery monomers are fixed and encapsulated through series and parallel connection to form a standardized unit.3. Thermal Management SystemLiquid Cold Plate: Controls the temperature by circulating coolant (more on this later).Thermal Conductive Adhesive/Spacer: Fill the gap between the battery and the cold plate to improve the heat conduction efficiency.4. Battery Management System (BMS)Monitors voltage, temperature, and state of charge (SOC) to ensure safe and balanced charging and discharging.5. Structural  Frame and HousingMade of aluminum alloy or high-strength plastic to provide mechanical support and protection against impact, vibration and external environmental erosion.6. Electrical Connection ComponentsHigh-voltage wiring harnesses, connectors, safety devices, etc., to ensure stable current transmission.7. Safety ComponentsPressure relief valve, fireproof isolation layer, etc., to prevent the spread of thermal runaway.What Is Electric Vehicle Battery Liquid Cooling Plate?EV battery cell liquid cold plate is a heat-conducting component integrated in the thermal management system of the battery pack to regulate the battery temperature. It works by circulating a coolant (typically a water-glycol mixture) through internal runners to absorb the heat generated during battery operation or charging. By maintaining the battery temperature in an optimal range (typically 20°C-40°C), liquid-cooled plates prevent overheating, thermal runaway and performance degradation.Battery cell liquid cold plate technology is critical for modern electric vehicles, as lithium-ion batteries are highly sensitive to temperature extremes. Without efficient cooling, batteries can face shortened lifetimes, safety hazards and even catastrophic failures.Why Are Battery Liquid Cooling Plates So Important?Enhance SecurityOverheating can cause thermal runaway (a chain reaction leading to fire or explosion). A well-designed liquid cooled battery plate dissipates heat quickly and significantly reduces this risk.Extends Battery LifeHigh temperatures accelerate battery aging. Effective cooling ensures that the battery operates reliably and maintains its capacity over thousands of charge/discharge cycles.Optimize PerformanceBatteries operate efficiently only within a narrow temperature range. Continuous cooling supports fast charging, high power output and longer range.Space and Lightweight AdvantagesLiquid-cooled plates provide better heat dissipation in a more compact structure than air-cooling, making them suitable for high-density layouts of battery modules.Main Types of Liquid-cooled Plates for Electric Vehicle BatteriesAccording to thermal management requirements, space constraints and cost considerations, liquid cooling panel designs are categorized into the following types:1. Harmonica tube type liquid cooling platesAdvantages: low cost, light weight, relatively simple structure, high production efficiency.Limitations: single flow path, small contact area, thin pipe wall, general heat transfer effect, poor load-bearing capacity.2. Stamping type liquid cooling plateAdvantages: arbitrary design of runner, large contact area, good heat transfer effect, high production efficiency, good pressure resistance and strength.Limitations: need to open the mold, high cost, and high flatness requirements, installation difficulties.3. Aluminum blowing liquid cooling plateAdvantage: low cost, good heat exchange, high production efficiency.Limitations: The material is soft, so it is weak in terms of pressure resistance and strength.4. Snake tube liquid cold plateAdvantage: Good heat transfer, suitable for cylindrical cells.Limitation: Complex structure and high cost.5. Friction stir welding liquid cooling plateAdvantages: good reliability, good load bearing capacity, good surface flatness, good heat exchange effect.Limitations: complex processing, high cost, thicker and heavier and high space occupation.How to Choose the Right Liquid Cooling Plate for Your Battery?The following factors need to be considered when choosing a liquid cooling plate:Thermal load: High-performance cells may require a snake tube or microchannel design.Space constraints: stamping cold plates are suitable for compact modules.Cost: snake tube cold plates and stamping cold plates are more economical.Durability: Aluminum alloys are popular for their light weight and corrosion resistance.As electric vehicles become more popular, battery liquid cooling panel design will continue to be critical. At Lori, we are committed to providing cutting-edge solutions, focusing on customized electric vehicle battery cooling systems that balance thermal efficiency, weight, and cost to ensure that your battery packs operate safely and efficiently and meet the escalating demands of the automotive industry.Contact the Lori team to customize a personalized cooling solution for your next project!

What is server memory? Why do You need to cool it?In data centers and cloud computing infrastructures, server memory is the core hardware that carries high-speed access to data. Unlike ordinary desktop memory, server memory (e.g., DDR4/DDR5 RDIMM/LRDIMM) features higher capacity (up to 256GB in a single strip), stronger error correction (ECC technology), and multi-channel design to meet the demands of high-load scenarios such as AI training and big data analysis.However, the densification of memory modules is causing a heat dissipation crisis:The power of a single DDR5 memory can reach 15-20W, and even some single rack memory power densities have exceeded 30W/DIMMFailure rate incre ases by 30% for every 10°C increase in memory temperature (based on reliability data)Traditional air-cooled cooling efficiency drops by 50% at 40°C ambient temperature.When the memory temperature exceeds 85°C, the system triggers underclocking protection, resulting in a precipitous drop in computing performance. Efficient heat dissipation has become a key battleground for ensuring server stability and energy efficiency ratio.Lori Server Memory Liquid Cooling Customized Design1.DIMM Cold Plate: Micro-channel design for precise temperature controlLori's customized liquid cooling solution for memory modules adopts a fully wrapped aluminum/copper alloy cold plate/stainless steel cold plate, which directly touches the memory module chips through precision machined microchannels.Lori's customized DIMM Cold Plate supports different DIMM pitches (DDR4 and DDR5), which is suitable for a wide range of server architectures, and eliminates the need to replace the entire cooling system due to hardware upgrades. Stainless Steel and Copper Server Memory Liquid CoolerDIMM cold plate for Server Memory Liquid Cooling Solution2.Server Memory Module Custom Liquid Cooling LoopLori can provide direct liquid cooling open loops for CPU, GPU, DIMM and other chips according to the customer's server liquid cooling deployment requirements. The customized memory and CPU modular liquid cooling loops are formed by welding metal pipes and CPU cold plates and memory module cold plates through the vacuum brazing process, which ensures that there is no leakage of the liquid cooling system of liquid-cooled servers and the equipment is safe and stable to operate while efficiently dissipating heat.Lori Server Memory Module Liquid Cooling LoopServer Memory and CPU Module Liquid Cooling LoopCore Advantages of Memory Liquid Cooling Technology1. Precise temperature control and thermal resistance optimizationDIMM Cold Plate is in direct contact with the memory chips through the micro-flow channel design, and the liquid cooling of the cold plate can reduce the thermal resistance to less than 0.03°C/W. The strong heat dissipation capability of a single module ensures that the temperature of the memory is stabilized at a safe threshold value. Combined with the intelligent temperature control system, the coolant flow can be adjusted in real time according to the memory load to avoid the formation of localized hotspots.2. Energy efficiency improvement and PUE optimizationLiquid-cooled memory module can reduce the energy consumption of heat dissipation to 1/10 of that of air-cooling, for example, for a traditional air-cooled system that consumes 500kW of power to dissipate heat, liquid cooling only requires 30kW, which is a significant energy saving benefit. The liquid cooling solution for memory modular cold plate reduces the overall PUE value of the data center to less than 1.2.3. Space utilization and deployment flexibilityThe liquid cooling design eliminates the need to reserve space for air ducts and supports high-density stacking of memory modules (e.g., integrating more DIMM slots in a 1U server) to increase the computing power density of a single rack. The modular memory liquid cooling design is compatible with existing server architectures, making it easy to retrofit existing data centers and reducing upgrade costs.Key application scenarios for liquid memory coolingAI Training and ReasoningAI model training requires frequent reading and writing of large-scale datasets, which increases the demand for memory bandwidth and capacity. Liquid-cooled memory can avoid computation interruptions due to insufficient heat dissipation. For example, after a supercomputing center adopted cold plate liquid cooling, the memory error rate of AI clusters dropped by 92%.High Performance Computing (HPC)In scenarios such as weather simulation and gene sequencing, continuous high-load operation requires high memory stability. The liquid cooling solution extends hardware life and reduces maintenance frequency through precise temperature control.Edge Computing and Compact Data CentersEdge devices are limited by space and power supply, and the compact design of liquid-cooled memory (e.g., integrated cold plate loop) supports high-density deployment while reducing noise pollution, making it suitable for real-time demanding scenarios such as medical image processing and autonomous driving.With the exponential growth of arithmetic demand, server memory liquid cooling solutions have become the core technology for liquid-cooled servers to break through the arithmetic bottleneck and transform green data centers. Lori provides cutting-edge thermal management technologies and innovative solutions for the global computing infrastructure through innovative designs ,DIMM cold plates, memory and CPU modular liquid cooling loops and so on.

NVIDIA's new generation of GB300AI servers will use the “Blackwell Ultra” architecture, due to the significant increase in performance, resulting in a significant increase in power consumption, will cancel the fan air cooling version and use the full liquid cooling solution, the full use of liquid cooling systems and to “liquid-to-liquid” mode, and the GB300 CPU and GPU will switch to a socket design, the demand for liquid cooling snap-in connectors will double. GB300 CPUs and GPUs will switch to socket design, which will exponentially increase the demand for liquid cooling quick-connect couplings. GB300 liquid cooling quick-connect couplings are required for 1 GB200 server cabinet, and it is expected that the number of liquid cooling quick-connect couplings required for 300 cabinets can reach 600, which will usher in an exponential growth of liquid cooling quick-connect couplings market.What is a universal quick disconnect?Universal quick disconnect (UQD), also known as quick disconnect (QD), are used in computers or servers with liquid-cooling systems, and are one of the key components of liquid-cooling systems.UQDs have become the core components of liquid-cooling systems in data centers due to their high efficiency, safety, reliability and other characteristics.UQD series quick couplings are a global open standard developed by the Open Compute Project (OCP) to achieve leak-free and fast switching of liquid cooling system connectors in data centers. The design concept is to provide a coupler solution that can be connected quickly and without leakage, specifically serving data centers, supercomputers, Internet switches and other scenarios that require liquid-cooling technology to process.Features of UQDUQD's leak-free, high-flow, low resistance, hot-swappable features are key to efficient data center operation and maintenance.Safe and leak-free: critical to the normal operation of a liquid cooling system, as electronic components are close to the coolant circulation system and can easily be damaged or malfunction due to leakage.High flow rate and low flow resistance: Ensures smooth flow of coolant through the system for efficient heat exchange, which helps maintain normal temperature of servers and other equipment during high power operation, ensuring performance and stability of the equipment.Supports hot-swapping: allows connection or disconnection operations without stopping system operation, which is important for data centers that require uninterrupted operation.UQD Application Scenarios1.Board Level Liquid cooling Heat DissipationIn high power density servers, the UQD connector connects the cold plate and the manifold to transfer the heat generated by the chip through the coolant to achieve efficient heat exchange. liquid cooling cold plate is the heat dissipation equipment directly contacting with server boards, and it is also the smallest unit of heat dissipation in data centers. Server liquid cooling cold plate includes liquid inlet connector, liquid outlet connector, upper cover plate and bottom plate, which are connected by vacuum brazing process to form a sealed liquid heat transfer cavity, and inside the cavity, liquid-sharing cavities and infusion grooves of different widths are set up according to the location of the chip and heat dissipation needs to realize the throttling control of the liquid flow and increase the perturbation, enhance the local heat dissipation capacity of the cold plate, and eliminate hotspots and heat dissipation bottlenecks caused by the high-power chips. Eliminate hot spots caused by high power chips.2.Rack-level liquid cooling systemInside the data center, information technology equipment is usually configured in accordance with rack units. Racks serve as the infrastructure for storing various types of information equipment within the data center, including but not limited to servers, storage devices, network switches and other key components. While board-level cooling is responsible for exporting the heat generated by individual IT equipment first, the entire rack is tasked with centralizing and efficiently transferring this heat to the external environment. The core components of a liquid cooling system at the rack level include key components such as inlet and return water distributors (manifolds), monitoring units, temperature sensors, solenoid valves, and check valves. The inlet and outlet Manifolds are connected externally to the liquid cooling distribution unit at the server room level, and internally to the inlet and outlet fittings of the liquid cooling plate through quick connectors, and the heat of the system is transferred to the outside of the rack through the Manifolds.In recent years, the penetration of liquid cooling servers in major data centers has continued to increase, for example, shipments of NVIDIA's Blackwell series of chips have increased, driving market demand for liquid-cooling technology. As a manufacturer and supplier of liquid cooling components for data centers, Lori's liquid cooling quick disconnects are tested and certified to ensure that liquid cooling systems are free from the risk of leakage and seepage.

With the explosive growth of new energy vehicles, data centers, energy storage systems and other fields, the thermal performance of liquid cooling plates (water cooling plates) directly determines the stability and life of equipment operation. Different processing techniques have a direct impact on the runner design, pressure resistance and cost efficiency of liquid cooling plates. In this article, we will analyze the technical characteristics of mainstream processes such as embedded tube, vacuum brazing, stir friction welding, deep hole drilling, etc., to help you accurately match the heat dissipation performance.Liquid Cooling Plates Processing Process of the Five Major Technology Routes1. Tube embedded process (buried tube)Copper Pipe Water Cooling Plates (Embedded Tube Cold Plate) FactoryTechnical principle: copper or stainless steel tubes are pre-buried in the grooves of the metal substrate (mostly aluminum) and fixed by mechanical pressing or brazing to form a closed flow channel.Core Advantage:Zero risk of weld leakage: the runner consists of a complete metal tube with no weld points for high long-term reliability.Low cost and mature process: suitable for standardized design and mass production.Limitations:Poor runner flexibility, only supports simple linear or serpentine layout, difficult to meet high-density heat dissipation needs.The combination of copper and aluminum dissimilar materials is prone to galvanic corrosion, requiring additional anti-corrosion treatment.Typical application:Server cabinet liquid cooling systemIndustrial inverter heat dissipation module2. Vacuum brazing processAluminum Battery Vacuum Brazing Liquid Cooling Cold PlateTechnical principle: in the vacuum furnace, the use of melting point lower than the base material brazing material (such as Al-Si alloy) melted and penetrated into the runner plate and cover plate of the bonding surface, after cooling to form a high-strength metallurgical bond.Core Advantage:Complex runner free design: Supporting micro-channels, fins and other refined structures, heat dissipation efficiency is increased by more than 30%.Lightweight and High Pressure Resistance: All aluminum alloy material, high bonding strength on the welding surface, can withstand more than 10Bar pressure.Key Challenges:Stringent requirements for brazing material formulation and vacuum control, process defects easily lead to flow channel blockage or leakage.High investment in equipment, suitable for large-scale production.Typical applications:New energy vehicle power battery liquid cooling plate5G base station high power chip liquid cold plate3. Friction Stir Welding (FSW) processFSW Friction Stir Welding Process Liquid Cold PlateTechnical principle: The high-speed rotating stirring needle is inserted into the seams of the workpiece, the friction generates heat to plasticize the material, and solid-state welding is realized under mechanical extrusion.Core Advantages:Ultra-high structural strength: the strength of the weld seam reaches more than 90% of the base material, with excellent anti-vibration and anti-fatigue properties.Environmentally friendly and consumable-free: no need for welding wire and shielding gas, reducing carbon emissions.Process Limitations:High cost of equipment customization, slow welding speed (usually 0.5-1.5m/min).Limited adaptability to workpiece thickness and curved surface structure.Typical Applications:Water-cooled panels for shaped battery packs (e.g. CTP/CTC cell structures)Aerospace electronics cooling systems4. Deep hole drilling processDeep Hole Drilling Liquid Cooling PlateTechnical principle: Direct drilling of micro-holes with a depth-to-diameter ratio greater than 10:1 on metal substrates (e.g., copper, aluminum), and the formation of a circulating cooling network through external piping connections.Core Advantage:Extreme heat dissipation performance: smooth inner wall of drilled runners, low resistance to water flow, high heat exchange efficiency.High material utilization: no need for multi-layer structure stacking, suitable for high thermal conductivity copper processing.Key Difficulties:Deep hole processing is easy to deflection, need to be equipped with high-precision CNC machine tools and gun drilling tools.The flow path cannot be crossed, and the degree of design freedom is lower than that of brazing process.Typical applications:Copper-based water cooling plates for IGBT power modulesHigh heat density water cold plate for lasers5. Stamping + brazing composite processStamping and Vacuum Brazing Liquid Cold PlateTechnical principle: Stamping to form the runner structure, and then sealing with the cover plate through brazing, combining efficiency and performance.Core advantages:Optimal cost performance: stamping molding speed, brazing to enhance the sealing, the cost per piece is 40% lower than FSW.Compatible with shaped design: support wave shape, bifurcated runner and other medium-complexity structures.Typical applications:Liquid cooling plates for energy storage containersInverter heat dissipation module for household appliances Process Selection Guide: 4 Key Decision-making FactorsThermal power density>500W/cm²: Priority is given to deep hole drilling copper-based water cooling plates or vacuum brazing microchannels.<200W/cm²: embedded tube or stamping process is more cost-effective.Batch size and costSmall batch customization: friction stir welding, deep hole drilling.High volume production: vacuum brazing, tube embedded.Environmental adaptabilityHigh-vibration scenarios (e.g., automotive): FSW or tube embedded (no welds).Corrosive environments:vacuum brazed all-aluminum alloy structure.Complexity of runner design3D three-dimensional flow path: vacuum brazing.Simple linear flow path: tube embedded/stamping process.From the economy and reliability of embedded tube cold plate to the extreme performance of deep hole drilling cold plate, the diversity of liquid cooling plate processing technology provides precise solutions for different application scenarios. In the future, with the electric.