Data center cooling refers to the equipment, systems, methods, and techniques that regulate the temperature, humidity, and airflow within a data center facility. Thousands of servers, IT equipment and other electronic devices running around the clock in a data center generate a lot of heat, and data center cooling cools this equipment down to maintain optimal performance.How is a Data Center Cooled?Data center cooling systems use a range of technologies, key components, and equipment to keep data centers in top shape, with the core goal of efficiently removing and discharging waste heat generated by servers and other equipment to the outside environment. The main technology schools include:Air CoolingPrinciple: Utilizes cool air. The computer room air conditioner (CRAC/CRAH) produces cold air and sends it through raised floors or ducts to the front of the server cabinet (cold aisle). The server fan draws in the cold air to cool the internal components, and the heated air is discharged from the rear (hot aisle), where it is drawn back, cooled, and recirculated by the air conditioning system.Key Technology Points:Cold/Hot aisle isolation: Physically isolates hot and cold airflow, avoiding short-circuiting of mixed air and dramatically improving efficiency (basic but extremely important!)Raised floor air supply: Utilizing the under-floor space as a static pressure box to evenly deliver cold air.Precise air supply: Use air ducts and blind plates to block the empty space to ensure that the cold air is accurately delivered to the air inlet of the equipment.Advantages: Mature technology, relatively simple deployment, low initial cost, high maintenance familiarity.Disadvantages: relatively low efficiency (especially for high-density cabinets), high noise, occupying more space (requires a large channel), attenuation of the efficiency of long-distance cold air delivery. Suitable for low and medium density scenarios.Water cooling Principle: The use of water (or other liquids) as a refrigerant. The specific heat capacity of water is much larger than air (heat absorption capacity is about 4 times stronger), so the efficiency is higher.Common forms: Chilled water system: The chiller produces chilled water (e.g. at 7°C), which is pumped through pipes to cooling coils in the server room (usually close to the heat source or integrated in the cabinet). The hot air in the server room flows through the coils to be cooled, and the chilled water absorbs heat and warms up before returning to the chiller to cool down. This is currently the mainstream high-efficiency solution for large data centers.Water-side natural cooling: Using the external natural environment (cold air, lake/sea water) to directly or indirectly cool the chilled water circulating system, the compressor can be drastically reduced or even shut down in cold seasons/areas, which significantly saves energy (free cooling!). Common methods: cooling towers, plate heat exchangers, dry coolers.Direct Evaporative Cooling: Direct cooling of air using the principle of heat absorption by water evaporation (e.g. large humidifiers). Excellent and energy efficient in dry areas.Advantages: high cooling efficiency, suitable for high densities, high energy saving potential (especially in combination with natural cooling), relatively low noise.Disadvantages: More complex systems, high initial investment, specialized water treatment (anti-scaling, corrosion, microbiology), risk of water leakage (requires sophisticated testing and protection).Liquid Cooling Principle: Groundbreaking coolant (special non-conductive liquid or water) in direct contact with the heating element (chip) or submerging the entire server. Inefficient air heat transfer is skipped.Main Types: Direct Liquid Cooling (Direct to Chip Liquid Cooling)The metal cold plate (containing micro-channels) closely fits the CPU/GPU and other major heat generating chips. The coolant flows through the inside of the cold plate, directly taking away the heat from the chip. The rest of the server is still air-cooled. The current mainstream liquid cooling form.Immersion liquid coolingSingle-phase immersion: The server is completely immersed in a non-conductive, non-volatile (high boiling point) coolant. The liquid is circulated internally and heat is carried out to an external heat exchanger by convection or pump drive.Phase Change Immersion: The server is immersed in a low boiling point coolant. The liquid contacts the heat chip and absorbs heat and boils (phase change), the vapor rises to the condenser and cools back to a liquid drop, and the cycle repeats. Maximum efficiency!Core Advantage: 1.Superior Heat Dissipation Capability: Easily cope with ultra-high densities of 50kW/cabinet or even 100kW+ (a must for AI/GPU clusters!) Extreme Energy Efficiency: Dramatically reduce or even reduce the amount of energy needed to power the system.2.Ultimate Energy Efficiency: Dramatically reduce or even completely eliminate server fan energy consumption; coolant transfer pumps consume far less energy than large fans; it is easier to utilize high-temperature return water to achieve efficient natural cooling.3.Quiet: Fan noise virtually disappears in the server room.4.Space Savings: Allows for more compact server room designs.Challenges: High initial cost, high retrofit or deployment complexity, specialized IT equipment design/certification (especially immersion), coolant selection and management (cost, maintenance, environmental).Natural Cooling (Free Cooling)Principle: Not a stand-alone technology, but utilizes the coldness of the external natural environment (low-temperature air, bodies of water) to carry out part or all of the cooling tasks, reducing or avoiding the use of energy-intensive compressors.Realization:Air-side natural cooling: When the outside air is sufficiently cold and clean, the filtered fresh air is introduced directly (or the indoor air is cooled indirectly through a heat exchanger).Water-side natural cooling: cooling tower, plate heat exchanger, dry cooler, etc., the use of low-temperature air or natural water to cool the chilled water system circulating water.Seawater/lake water cooling: Direct extraction of deep low-temperature seawater/lake water as cooling source (requires strict corrosion prevention and water treatment).Key point: Energy efficiency depends on local climate conditions (duration of low temperatures) and system design. It is a key factor in evaluating the PUE (energy efficiency index) of a data center.These are the main cooling systems in a data center. With the explosive growth in demand for high-density computing such as AI and HPC, liquid cooling (especially direct liquid cooling) is moving from the “frontier” to the “mainstream”. Welcome to contact Lori consulting for relevant cooling solutions.

The electric vehicle (EV) revolution is accelerating at an alarming rate. Global electric vehicle sales have exceeded 10 million units in 2022 (IEA data), and such a large fleet requires a reliable, high-speed charging infrastructure. Charging piles are an indispensable part of the supporting infrastructure for electric vehicles, providing charging services for electric vehicles. According to the different ways of power supply, they can be divided into AC charging piles and DC charging piles. Among them, DC fast charging piles (DCFC) can directly convert alternating current (AC) from the power grid to direct current (DC) available to the battery of an electric vehicle, allowing many modern electric vehicles to be charged from 20% to 80% in as little as 20-30 minutes.Why do charging posts need to dissipate heat?The fast charging capacity of DC charging piles leads to the generation of a large amount of heat. The main sources of this heat are: Power conversion losses: Inefficiencies within semiconductors and transformers during the conversion of AC to DC and the boosting process generate a lot of heat.High current flow: The resistance of cables, connectors and internal components leads to heat that is proportional to the square of the current (I²R loss).Out-of-control heat is not only an inconvenience, it is a direct threat to the performance, safety and longevity of the charging post. Heat dissipation in charging piles can ensure the performance, safety and life of charging piles: Protecting equipment: EV charging piles are a kind of high-voltage equipment with complex internal circuits, including transformers, capacitors and other key components. During the charging process, these components will generate heat due to the passage of current. If the heat is not dissipated in time, it may cause the equipment to overheat or even burn out, affecting the normal operation of the equipment.Improve service life: Effective heat dissipation ensures that the charging pile remains stable during use, thus extending its service life. This can reduce the cost of equipment replacement for public places or companies with a large number of charging piles.Ensure safety: If the charging pile overheats during the charging process, it may cause fire or other safety accidents. Therefore, taking effective heat dissipation measures can reduce the risk and safeguard the safety of users and equipment.Main heat dissipation methods of charging pile1. Forced air convection cooling (e.g., independent air ducts, optimized ventilation system): accelerating the air flow to take away the heat through the fan, widely used in low and medium power scenarios.Principle: The internal fan actively draws in the cooler surrounding air and makes it flow through the heat sink attached to the heating element (e.g., power module), and then discharges the heated air.Advantages: Relatively simple, cost-effective, low maintenance requirements.Disadvantages: Limited cooling capacity for ultra-high-speed charging piles (350kW+); performance degradation at high ambient temperatures; dust/moisture inhalation, requiring a robust filtration system; may be noisy.2. Liquid cooling heat dissipation system: absorbs heat through coolant circulation, suitable for high power (60kW and above) DC charging pile, such as liquid cooling heat dissipation technology.Principle: a sealed coolant circulation loop, so that the liquid (usually water-glycol mixture) flows through the liquid cold plate in direct contact with the key heat source (power electronic components). The heated coolant is pumped to a heat sink, cooled by air (sometimes with the aid of a fan) and then re-circulated.Advantages: Outstanding heat conduction efficiency, capable of supporting higher continuous power (particularly crucial for 350kW+ charging piles).  The design is more compact It runs more quietly.  It offers better protection in harsh environments such as dust and moisture.  It performs more stably in high-temperature environments.Disadvantages: More complex design, higher initial cost, and possible maintenance requirements for pumps/seals.Applicable scenarios: High-power DC fast charging piles (150kW+), ultra-fast charging piles (350kW+), and places with extreme temperatures or strict environmental requirements.3. Natural heat dissipation and potting isolation: low power scenarios often use natural heat sinks or thermally conductive potting adhesive to improve protection performance.Principle: Completely rely on passive heat dissipation, through carefully designed heat sinks and chassis ventilation structure, using natural air flow (hot air rise) to dissipate heat. Potting is a way of dissipating heat by filling the tiny gaps between the heat dissipating components and the heat dissipating surfaces with a thermally conductive adhesive to improve the efficiency of heat conduction.Advantages: Simplest design, completely silent, very low maintenance requirements, high reliability.Disadvantages: Very limited cooling capacity. Only suitable for low power applications (e.g. Level 1/2 AC charging posts).Scenarios: Basic household use and low power public AC charging stations.As EV battery capacity increases and charging speeds push toward 350kW and beyond, effective thermal management is no longer optional - it's a foundational requirement. Although more complex, liquid cooling systems are fast becoming the gold standard for high-power DC fast charging stations (DCFC), ensuring reliability, safety, and the ability to deliver on the promise of ultra-fast charging, with continuous and stable operation, even under harsh conditions.LORI: Reliable Charging Experience through Advanced Thermal TechnologyAt LORI, we understand the critical role that thermal management plays in the performance and longevity of a charging station. We carefully design thermal solutions for high power DC fast charging piles, as well as provide cooling components such as liquid cooling panels, natural heat sinks, and thermal modules and so on, optimized for their specific power levels and target application environments. Whether it's a robust forced air-cooling system designed for consistent performance or cutting-edge liquid-cooling technology for our most powerful superchargers, LORI always prioritizes thermal efficiency to ensure the highest uptime, safety and user satisfaction.Liquid Cooling PlatesNatural Heat SinksCustom Cooling ModuleReady to deploy a reliable, high-performance electric vehicle charging infrastructure? We're designed to meet the challenges of high temperatures. Discover LORI's future-proof, advanced charging solutions.

What is an EV Battery Pack?An EV battery pack is the energy storage core unit of an electric vehicle, usually consisting of multiple battery modules connected in series or parallel, each containing tens to hundreds of lithium-ion battery cells (Cells). The battery pack provides stable and efficient power output for the vehicle by integrating thermal management system, battery management system (BMS) and structural protection components.Main Components of a Power Vehicle Battery Pack             A complete battery pack usually contains the following core components:1. Battery Cell (Cell)Lithium-ion batteries are the mainstream choice, responsible for storing and releasing electrical energy.2. Battery ModuleMultiple battery monomers are fixed and encapsulated through series and parallel connection to form a standardized unit.3. Thermal Management SystemLiquid Cold Plate: Controls the temperature by circulating coolant (more on this later).Thermal Conductive Adhesive/Spacer: Fill the gap between the battery and the cold plate to improve the heat conduction efficiency.4. Battery Management System (BMS)Monitors voltage, temperature, and state of charge (SOC) to ensure safe and balanced charging and discharging.5. Structural  Frame and HousingMade of aluminum alloy or high-strength plastic to provide mechanical support and protection against impact, vibration and external environmental erosion.6. Electrical Connection ComponentsHigh-voltage wiring harnesses, connectors, safety devices, etc., to ensure stable current transmission.7. Safety ComponentsPressure relief valve, fireproof isolation layer, etc., to prevent the spread of thermal runaway.What Is Electric Vehicle Battery Liquid Cooling Plate?EV battery cell liquid cold plate is a heat-conducting component integrated in the thermal management system of the battery pack to regulate the battery temperature. It works by circulating a coolant (typically a water-glycol mixture) through internal runners to absorb the heat generated during battery operation or charging. By maintaining the battery temperature in an optimal range (typically 20°C-40°C), liquid-cooled plates prevent overheating, thermal runaway and performance degradation.Battery cell liquid cold plate technology is critical for modern electric vehicles, as lithium-ion batteries are highly sensitive to temperature extremes. Without efficient cooling, batteries can face shortened lifetimes, safety hazards and even catastrophic failures.Why Are Battery Liquid Cooling Plates So Important?Enhance SecurityOverheating can cause thermal runaway (a chain reaction leading to fire or explosion). A well-designed liquid cooled battery plate dissipates heat quickly and significantly reduces this risk.Extends Battery LifeHigh temperatures accelerate battery aging. Effective cooling ensures that the battery operates reliably and maintains its capacity over thousands of charge/discharge cycles.Optimize PerformanceBatteries operate efficiently only within a narrow temperature range. Continuous cooling supports fast charging, high power output and longer range.Space and Lightweight AdvantagesLiquid-cooled plates provide better heat dissipation in a more compact structure than air-cooling, making them suitable for high-density layouts of battery modules.Main Types of Liquid-cooled Plates for Electric Vehicle BatteriesAccording to thermal management requirements, space constraints and cost considerations, liquid cooling panel designs are categorized into the following types:1. Harmonica tube type liquid cooling platesAdvantages: low cost, light weight, relatively simple structure, high production efficiency.Limitations: single flow path, small contact area, thin pipe wall, general heat transfer effect, poor load-bearing capacity.2. Stamping type liquid cooling plateAdvantages: arbitrary design of runner, large contact area, good heat transfer effect, high production efficiency, good pressure resistance and strength.Limitations: need to open the mold, high cost, and high flatness requirements, installation difficulties.3. Aluminum blowing liquid cooling plateAdvantage: low cost, good heat exchange, high production efficiency.Limitations: The material is soft, so it is weak in terms of pressure resistance and strength.4. Snake tube liquid cold plateAdvantage: Good heat transfer, suitable for cylindrical cells.Limitation: Complex structure and high cost.5. Friction stir welding liquid cooling plateAdvantages: good reliability, good load bearing capacity, good surface flatness, good heat exchange effect.Limitations: complex processing, high cost, thicker and heavier and high space occupation.How to Choose the Right Liquid Cooling Plate for Your Battery?The following factors need to be considered when choosing a liquid cooling plate:Thermal load: High-performance cells may require a snake tube or microchannel design.Space constraints: stamping cold plates are suitable for compact modules.Cost: snake tube cold plates and stamping cold plates are more economical.Durability: Aluminum alloys are popular for their light weight and corrosion resistance.As electric vehicles become more popular, battery liquid cooling panel design will continue to be critical. At Lori, we are committed to providing cutting-edge solutions, focusing on customized electric vehicle battery cooling systems that balance thermal efficiency, weight, and cost to ensure that your battery packs operate safely and efficiently and meet the escalating demands of the automotive industry.Contact the Lori team to customize a personalized cooling solution for your next project!

What is server memory? Why do You need to cool it?In data centers and cloud computing infrastructures, server memory is the core hardware that carries high-speed access to data. Unlike ordinary desktop memory, server memory (e.g., DDR4/DDR5 RDIMM/LRDIMM) features higher capacity (up to 256GB in a single strip), stronger error correction (ECC technology), and multi-channel design to meet the demands of high-load scenarios such as AI training and big data analysis.However, the densification of memory modules is causing a heat dissipation crisis:The power of a single DDR5 memory can reach 15-20W, and even some single rack memory power densities have exceeded 30W/DIMMFailure rate incre ases by 30% for every 10°C increase in memory temperature (based on reliability data)Traditional air-cooled cooling efficiency drops by 50% at 40°C ambient temperature.When the memory temperature exceeds 85°C, the system triggers underclocking protection, resulting in a precipitous drop in computing performance. Efficient heat dissipation has become a key battleground for ensuring server stability and energy efficiency ratio.Lori Server Memory Liquid Cooling Customized Design1.DIMM Cold Plate: Micro-channel design for precise temperature controlLori's customized liquid cooling solution for memory modules adopts a fully wrapped aluminum/copper alloy cold plate/stainless steel cold plate, which directly touches the memory module chips through precision machined microchannels.Lori's customized DIMM Cold Plate supports different DIMM pitches (DDR4 and DDR5), which is suitable for a wide range of server architectures, and eliminates the need to replace the entire cooling system due to hardware upgrades. Stainless Steel and Copper Server Memory Liquid CoolerDIMM cold plate for Server Memory Liquid Cooling Solution2.Server Memory Module Custom Liquid Cooling LoopLori can provide direct liquid cooling open loops for CPU, GPU, DIMM and other chips according to the customer's server liquid cooling deployment requirements. The customized memory and CPU modular liquid cooling loops are formed by welding metal pipes and CPU cold plates and memory module cold plates through the vacuum brazing process, which ensures that there is no leakage of the liquid cooling system of liquid-cooled servers and the equipment is safe and stable to operate while efficiently dissipating heat.Lori Server Memory Module Liquid Cooling LoopServer Memory and CPU Module Liquid Cooling LoopCore Advantages of Memory Liquid Cooling Technology1. Precise temperature control and thermal resistance optimizationDIMM Cold Plate is in direct contact with the memory chips through the micro-flow channel design, and the liquid cooling of the cold plate can reduce the thermal resistance to less than 0.03°C/W. The strong heat dissipation capability of a single module ensures that the temperature of the memory is stabilized at a safe threshold value. Combined with the intelligent temperature control system, the coolant flow can be adjusted in real time according to the memory load to avoid the formation of localized hotspots.2. Energy efficiency improvement and PUE optimizationLiquid-cooled memory module can reduce the energy consumption of heat dissipation to 1/10 of that of air-cooling, for example, for a traditional air-cooled system that consumes 500kW of power to dissipate heat, liquid cooling only requires 30kW, which is a significant energy saving benefit. The liquid cooling solution for memory modular cold plate reduces the overall PUE value of the data center to less than 1.2.3. Space utilization and deployment flexibilityThe liquid cooling design eliminates the need to reserve space for air ducts and supports high-density stacking of memory modules (e.g., integrating more DIMM slots in a 1U server) to increase the computing power density of a single rack. The modular memory liquid cooling design is compatible with existing server architectures, making it easy to retrofit existing data centers and reducing upgrade costs.Key application scenarios for liquid memory coolingAI Training and ReasoningAI model training requires frequent reading and writing of large-scale datasets, which increases the demand for memory bandwidth and capacity. Liquid-cooled memory can avoid computation interruptions due to insufficient heat dissipation. For example, after a supercomputing center adopted cold plate liquid cooling, the memory error rate of AI clusters dropped by 92%.High Performance Computing (HPC)In scenarios such as weather simulation and gene sequencing, continuous high-load operation requires high memory stability. The liquid cooling solution extends hardware life and reduces maintenance frequency through precise temperature control.Edge Computing and Compact Data CentersEdge devices are limited by space and power supply, and the compact design of liquid-cooled memory (e.g., integrated cold plate loop) supports high-density deployment while reducing noise pollution, making it suitable for real-time demanding scenarios such as medical image processing and autonomous driving.With the exponential growth of arithmetic demand, server memory liquid cooling solutions have become the core technology for liquid-cooled servers to break through the arithmetic bottleneck and transform green data centers. Lori provides cutting-edge thermal management technologies and innovative solutions for the global computing infrastructure through innovative designs ,DIMM cold plates, memory and CPU modular liquid cooling loops and so on.