With the rapid development of artificial intelligence (AI) technology, we are gradually entering a new era driven by intelligence. From autonomous vehicles to precision medicine, from cloud computing to education and entertainment, AI's application scenarios are becoming increasingly diverse, injecting robust momentum into the sustained growth of the global economy. It is predicted that the global AI market is expected to reach $1.4 trillion by 2029, with a compound annual growth rate of 20.1%. However, behind this prosperous scene, the rapid advancement of AI technology has also brought unprecedented challenges, particularly in thermal management, which has become a critical factor limiting the performance and reliability of AI systems.

Among the latest applications of AI, electric vehicles and advanced driver assistance systems (ADAS) are undoubtedly one of the most eye-catching fields. AI not only helps manage the energy resources of electric vehicles, optimizing charging and discharging cycles, but also significantly enhances driving safety and sustainability by analyzing sensor data. Meanwhile, the combination of cloud computing and AI has promoted the digital transformation of various industries, providing a series of efficient services such as machine learning and natural language processing, greatly improving operational efficiency. In the medical field, the application of AI has changed the traditional medical service model, demonstrating tremendous potential and value from improving the accuracy of medical imaging to diagnosing diseases, drug discovery, and patient monitoring.

However, as AI technology continues to advance, the requirements for computing devices are also increasing. Smaller, more powerful, and more energy-efficient computing devices have become the mainstream demand in the market. But this also means that the development of new hardware will generate higher thermal output, posing more stringent requirements on thermal management solutions. Traditional air-cooling technology has already been difficult to meet the current cooling needs of AI systems, and therefore, liquid cooling, as a promising solution, has gradually attracted widespread attention in the industry.

Tailored thermal management solutions are required for different AI applications. For example, in autonomous vehicles, the thermal management of AI systems mainly focuses on cooling onboard electronics and processors, which requires cooling solutions to be lightweight and durable. In medical and enterprise deep learning applications, the transition from air-cooling to high-performance liquid cooling has become a trend. Coolant distribution units (CDUs), as the core components of the next-generation thermal management system, are gradually dominating the market.

In this context, Lori, with its decades of industry experience, has designed and manufactured customized thermal management solutions for multiple industries. From coolant distribution devices, liquid loops, and cold plates to coolers, 3D vapor chambers, and remote heat pipe assemblies, Lori's solutions cover all aspects of thermal management. Leveraging its strong expertise in engineering and materials science, Lori can design innovative solutions with exceptional performance, reliability, and energy efficiency for specific applications.

In summary, thermal management in artificial intelligence is not only a current hot topic in technological development but also the key to the continuous and efficient operation of future AI systems. With continuous technological advancements and expanding markets, we have reason to believe that, driven by excellent companies such as Lori, the thermal management issues of AI will be more effectively addressed, thereby pushing AI technology towards a broader future.