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Vacuum Brazing High Density Copper Skived Microchannel CPU Liquid Cold Plate Heat Sink

Vacuum Brazing High Density Copper Skived Microchannel CPU Liquid Cold Plate Heat Sink

Type
Skived Fin Heat Sink
Brand Name
LORI
Model Number
LRC1003
Place of Origin
Shenzhen, China (Mainland)
Packing
Carton, Blister tray, Wooden pallet
Application
Liquid Cooling Sysytem
Payment
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15 days after payment
Quality Guarantee
1 years
Parameter
Place of Origin:Shenzhen, China (Mainland)OEM:Yes
Process:SkivingTemper:T3-T8
Material:

Copper

Brand Name:LORI
Packing:Paper carton Certificate:ISO 9001:2008,ISO 14001:2004
Application:Liquid Cooling SystemExtra Process:
CNC Machining + Passivating
Model Number:LRC1003Size:Customizable
Product Advantage

Vacuum Brazing High Density Copper Skived Microchannel CPU Liquid Cold Plate Heat Sink


Lori high density skived fin cold plate is designed for liquid cooling systems. The skiving fin process optimizes the microchannel design of the cold plate surface, increasing the contact area between the fluid and the cold plate, ensuring uniform fluid distribution and avoiding localized overheating problems. The copper skived microchannel liquid cold plate has high fluid cooling efficiency and excellent heat transfer properties, enabling rapid absorption of heat from the heat source and dissipate it.The microchannel CPU liquid cold plate heat sink has been fully tested and validated by Lori to ensure the best quality and cooling performance.  


           
Product Advantages
1.Improve Heat Dissipation Efficiency 

The skived fin heat sink has a high ,high density, ultra-thin fin and ultra-small spacing characteristic, which can increase the heat dissipation area per unit volume and improve the heat dissipation performance of the product.

2.Stable Thermal Conductivity

Compared with the skived fin heat sink, it has a one-time molding, stable thermal conductivity, no loss caused by the process and no risk of loosening and falling off, and the processing ability is increased in the later period, and the heat dissipation performance can be improved with buried copper pipes and other processes.

3.Higher Adaptability

It can meet the design requirements of large/ultra-small size high-power heat sink, and make up for the shortcomings of aluminum extrusion heat sink or extrusion heat sink structure.

4.System Stability 

It can replace profile heat sinks, skived fin heat sinks, folding FIN heat sinks, die casting heat sinks, forging heat sinks.

5.Diversification of Structural Types

Can do single side skived fins, can also do double side skived fins, pipe four sides skived fins, skived ring fins, particular shaped fins, etc.

Product Application

Suitable for new energy equipment, small energy storage backup, charging pile, high-end precision medical equipment, photovoltaic inverter, IGBT, motor controller, laser, supercomputer server, wind power converter and so on.


Energy Storage EquipmentEnergy Storage Equipment
Motor ControllerMotor Controller
Charging PileCharging Pile
Medical EquipmentMedical Equipment


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