| Place of Origin: | Shenzhen, China (Mainland) | OEM: | Yes |
| Process: | Reflow soldering,Stamping | Cooling type | Passive |
| Material: | Copper base + Al zipper+1 heat pipe | Shape: | Square |
| Packing: | Paper carton with wooden pallet | CPU Socket: | LGA2011/115X Narrow |
| Application: | 1U Server Intel CPU, IPC box, Computer | Power Dissipation: | 110 W |
| Model Number: | LGA115X-1U | Fin Thickness: | 0.25mm |
| Finish: | Passivating, Nickel plating | Fin Pitch: | 1.36 mm |
| Extra process: | CNC Machining | Size: | L90*W90*H27mm |
| Product environmental compliance | RoHS and REACH compliant | ||
1U Zipper Fin Heat Sink For Intel CPU LGA2011/115X
This Zipper Fin Heat Sink is 1U server passive solution for 1U Server Intel Narrow Cpu LGA2011/115X. Material included Copper base, Al zipper, 1 heat pipe, The 1U heat sink has been 100% tested and validated by Lori to ensure the best quality and cooling performance.
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E-mail:sales@lori-cn.com
Telephone:(0769) 2198 6220
Mobile phone:+86 13713030144
Address：No.6 Songhe North Road, Hongxing Community, Songgang Street, Baoan District, Shenzhen, Guangdong, China
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