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1U Zipper Fin Heat Sink For Intel CPU LGA2011/115X

1U Zipper Fin Heat Sink For Intel CPU LGA2011/115X

Type
1U Heat Sink
Brand Name
LORI
Model Number
LGA115X-1U1CA
Place of Origin
Shenzhen, China (Mainland)
Packing
Paper carton with wooden pallet
Application
Interl Cpu
Payment
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15days after payment
Quality Guarantee
1 year
Parameter
Place of Origin:Shenzhen, China (Mainland)OEM:Yes
Process:Reflow soldering,StampingCooling typePassive
Material: Copper base + Al zipper+1 heat pipeShape:Square
Packing:Paper carton with wooden palletCPU Socket: LGA2011/115X Narrow
Application:1U Server Intel CPU, IPC box, ComputerPower Dissipation:110 W
Model Number:LGA115X-1U1CAFin Thickness:0.25mm
Finish:Passivating, Nickel platingFin Pitch:1.36 mm
Extra process:CNC MachiningSize:L90*W90*H27mm
Product environmental complianceRoHS and REACH compliant
Product Description
1U Heat Sink For Intel CPU LGA2011/115X

1U Zipper Fin Heat Sink For Intel CPU LGA2011/115X

This  Zipper Fin Heat Sink is 1U server passive solution for 1U Server Intel Narrow Cpu LGA2011/115X. Material included Copper base, Al zipper, 1 heat pipe, The 1U heat sink has been 100% tested and validated by Lori to ensure the best quality and cooling performance.






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