|Place of Origin:||Shenzhen, China (Mainland)||OEM:||Yes|
|Process:||Reflow soldering,Stamping||Cooling type||Passive|
|Material:||Copper base + Al zipper+1 heat pipe||Shape:||Square|
|Packing:||Paper carton with wooden pallet||CPU Socket:||LGA2011/115X Narrow|
|Application:||1U Server Intel CPU, IPC box, Computer||Power Dissipation:||110 W|
|Model Number:||LGA115X-P12||Fin Thickness:||0.25mm|
|Finish:||Passivating, Nickel plating||Fin Pitch:||1.36 mm|
|Extra process:||CNC Machining||Size:||L90*W90*H27mm|
|Product environmental compliance||RoHS and REACH compliant|
1U Zipper Fin Heat Sink For Intel CPU LGA2011/115X
This Zipper Fin Heat Sink is 1U server passive solution for 1U Server Intel Narrow Cpu LGA2011/115X. Material included Copper base, Al zipper, 1 heat pipe, The 1U heat sink has been 100% tested and validated by Lori to ensure the best quality and cooling performance.
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