Heat pipe heatsink Advantages 

Heat pipe heatsink, heat pipe is a kind of heat conducting element which relies on the phase change of internal working medium for efficient heat transfer, the temperature uniformity of the heat sink base and the efficiency of fin are realized by embedding fin in the heat sink base, so as to realize the overall performance of heat sink, common types of aluminum, copper soldering for heat sink has been can not meet the requirement of the thermal resistance, need to use new heat sink with better performance.

Heat pipes are capable of quickly increasing the application area of self cooling. Since a heat pipe self-cooling system does not need any fan, it generates no noise and it doesn’t require maintenance so it’s safe and reliable. Heat pipe air cooling or self cooling can even replace water cooling systems so as to reserve water resources and the investment on relevant auxiliary equipment. Moreover, the heat pipe cooling approach allows the heat-dissipating devices to be concentrated and even sealed. This allows the cooling parts to be relocated to the exterior or in the distance so as to enhance the safety, reliability, and application range of electronic equipment and realize the dust-proof, damp-proof, and explosion-proof requirements

With heat pipe as the core, heat pipe  thermal module, which is composed of heat pipe, aluminum plate, can solve the heat dissipation problem caused by narrow space or too concentrated heat. The key parts is heat pipe that is an efficient heat conduction device made by using the principle of low pressure liquid phase change. Its heat transfer efficiency is dozens to hundreds of times that of traditional metals, can quickly take heat away from the heat source.

Heat pipe heat sinks in the power electronics field can be classified as follows according to the techniques used:

Profile + heat pipe

Skived Fin + heat pipe

Inserts + heat pipes

Snap-fit fin + heat pipe

Aluminum & copper plate + heat pipe

Heat pipe heatsink solved such as high power CPU, laptop CPU far end heat dissipation, mature technology, high reliability, the cost is also rapidly reduced with the growth of the consumption, the industry has begun to widely use at present. Some manufacturers in their high power consumption IC devices, high heat flux density modules and other applications have also adopted this kind of heat dissipation problem.

Applied to Communication, UPS, inverter, controller, wind power converter, SVG telecommunication.

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