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Soldering Heat Sinks For Server Cpu Lori

Soldering Heat Sinks For Server Cpu Lori

Type
Stamping High Power Soldering Heat Sink
Brand Name
LORI
Model Number
LR0139
Place of Origin
Shenzhen, China (Mainland)
Packing
Paper carton with wooden pallet
Application
Telecommunication, UPS, inverters, controllers, wind power converters, and SVG
Payment
T/T,L/C,Western Union,Paypal
Delivery Time
Shipped in 15 days after payment
Quality Guarantee
1 year
Parameter
Place of Origin:Shenzhen, China (Mainland)OEM:Yes
Process:SolderingTemper:T3-T8
Material:Aluminum heat pipe+AL6063Shape:Square
Packing:Standing Export Packing
Brand Name:
LORI
Application:

IT equipment and communication equipment 

Certificate:ISO 9001:2015,ISO 14001:2015
Model Number:LR0019Tolerance:
0.01 mm
Finish:Chemical nickel platingQuality control:100% thermal test
Extra process:CNC MachiningSize:250x230x120mm
Applied Field:

IT equipment and communication equipment , large server, large pv inverter , SVG/SVC , etc

Product Advantage
soldering heat sinks

Soldering heat sink advantages as following

1. High density fin, heat dissipation area, light weight. For soldering single fin, the groove can be processed on the bottom plate to insert the fin into the groove for welding. The density of the fin can be up to 1mm and the height can be up to 150mm.

2. The plate can be machined in a complex way, and can be embedded with heat pipes or vampor chamber, greatly increasing the average temperature.

3. The surface of soldering heat sink will not be oxidized by medium temperature machining.

4. The Soldering aluminum heat sink shape are flexible, which can easily process, install hole position and device avoiding position.

5. Low mold cost, from mini heatsink to large heat sink can be quickly mass production.

6. High reliability, has been widely used in IT equipment and communication equipment heat dissipation.

7. For surface treatment,aluminum can be welded only after nickel plating, red copper can be welded after rust and oil removal.



Product Details


Soldering heat sink
Heat sink soldering
solder heat sink to cpu
Production Process
Heat sink soldering

Stamping high power soldering heat sinks are designed to soldering the fins on aluminum or copper base by environmental protection lead-free medium temperature soldering process. 

The fins can be folded fin, L-fin, zipper fin, or fins with heat pipe, and the material is generally AL6063, AL6061, C1100, etc. 

According to the material, the soldering heat sink can be divided into aluminum soldering heat sinks, copper soldering heat sink, copper&aluminum composite soldering heat sinks, zipper fin soldering heat sink, heat pipe soldering heat sink.  According to the process, solder heatsink

 can be divided into high temperature welding and low temperature welding. For high temperature welding heatsink need 700-800 degrees to weld. Commonly used soldering process is low-temperature soldering, low-temperature soldering heat sinks temperature between 200-300 degrees, basically no deformation, can be process with high precision processing, can be used with any equipment.



Product Application


Solder heat sink applied to cpu New energy automobile , UPS and energy storage system , large server, large pv inverter , SVG/SVC , etc.
After Sales Instructions

 In order to ensure the best service to the customer , we have formulated this after-sales service system, the company solemnly to the users of after-sales service work to do the following commitment:

 1.Provide online technical support for customers, and provide consulting services on related issues

 2.From the date of spontaneous delivery, if there is any quality problem or quality objection to our company's customized products, please  contact with us in time. After checking and coordinating, we can return and replace the products in time.


Product Message
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