Aluminum and Copper Server Liquid Cooling Loop for Data Center Server CPU & GPU

The direct-to-chip liquid cooling assembly is made of AL 3003 /C1220, and and combine the advantages of aluminum and copper. Aluminum provides lightweight design and good thermal conductivity for the loop, and copper ensures excellent heat transfer efficiency and corrosion resistance. The CPU cold plate, GPU cold plate, piping, joints and other components are processed into a liquid cooling loop by a continuous furnace vacuum brazing and flame brazing process, which enhances the strength and sealing of the welds. The tensile strength of this vacuum brazed liquid cooling loop is 80-92N/mm², which provides good durability and structural stability under high-pressure environments. Lori's customized liquid cooling loops have excellent thermal conductivity, which effectively reduces the temperatures of the CPU, GPU and other core components and ensures the stability of the server's working environment.