Lori Thermal, a high performance heat sink manufacturer held the 2018 year-end party on Jan. 25th, 2019.All of our employees taken parted in the party and we also invited some suppliers and partners to join us. All of the employees burst into cheers and responded actively. We will work hard to produce and custom heatsink products with better quality and everyone will contribute his/her humble effort to Lori Thermal's progress at his/her own post.

It is difficult to use traditional welding or brazing in order to achieve good sealing and certain strength after processing at the same time.It is easy to occur solder block channel or solder loss of weak joint welding defects. That is why you need Friction Stir Welding Process technology.

As we all know, high temperature is the enemy of integrated circuits. High temperature will not only lead to unstable system operation, service life is shortened, and some parts may even burn out. Today we will look at how to select the right CPU heat sink.

LORI tells you the details about friction stir welding manufacturing aluminum alloy water cooling plate technology. The process of JiaGongShui helped make water cooled heat dissipation structure experiment success.

In the process of work, many people say that the heat sink to do anode, but it is not clear whether black or white is good. Here's an professional analysis from Lori heat sink supplier.

Friction stir welding process is adopted for water cooling plate, so as to make waterway design more free and seal reliability better. At the same time, hard anode surface treatment can be adopted.

As we all know, high temperature is the enemy of integrated circuits.High temperature will not only lead to unstable system operation, service life is shortened, and some parts may even burn out.The heat that causes high temperatures does not come from outside the computer, but from inside the computer.The role of the heat sink is to absorb the heat and keep the temperature of the computer parts normal.heat sink type is very much, CPU, graphics card, motherboard chipset, chassis, power supply will need heat sink, and one of the most common contact is the CPU heat sink.Subdivided cooling methods, can be divided into air cooling, heat pipe, water cooling, semiconductor refrigeration, compressor refrigeration and so on.